Rainbow Electronics ADC08351 - Manual (Page 5)

Converter Electrical Characteristics
(Continued)
The following specifications apply for V
A
= V
D
= +3.0 V
DC
, V
REF
= 2.4V, V
IN
= 1.63 V
P-P
, OE = 0V, C
L
= 20 pF,
f
CLK
= 42 MHz, 50% duty cycle, unless otherwise specified. Boldface limits apply for T
A
= T
MIN
to T
MAX
: all other limits T
A
=
25˚C (Notes 7, 8)
Symbol Parameter Conditions
Typical
(Note 9)
Limits
(Note 9)
Units
(Limits)
C
IN
Logic Input Capacitance 10 pF
Digital Output Characteristics
I
OH
High Level Output Current V
D
= 2.7V, V
OH
= V
D
−0.5V −1.1 mA (min)
I
OL
Low Level Output Current V
D
= 2.7V, OE = DGND, V
OL
= 0.4V 1.8 mA (min)
V
OH
High Level Output Voltage V
D
= 2.7V, I
OH
= −360 µA 2.65 V
V
OL
Low Level Output Voltage V
D
= 2.7V, I
OL
= 1.6 mA 0.2 V
I
OZH
,
I
OZL
TRI-STATE ® Output Current OE = V
D
= 3.3V, V
OH
= 3.3V or V
OL
= 0V ± 10 µA
AC Electrical Characteristics
f
C1
Maximum Conversion Rate 42 MHz (min)
f
C2
Minimum Conversion Rate 2 MHz
t
OD
Output Delay CLK High to Data Valid 14 19 ns (max)
Pipline Delay (Latency) 2.5
Clock
Cycles
t
DS
Sampling (Aperture) Delay CLK Low to Acquisition of Data 2 ns
t
OH
Output Hold Time CLK High to Data Invalid 9 ns
t
EN
OE Low to Data Valid Loaded as in Figure 2 14 ns
t
DIS
OE High to High Z State Loaded as in Figure 2 10 ns
ENOB Effective Number of Bits
f
CLK
= 30 MHz, f
IN
= 1 MHz 7.2 Bits
f
CLK
= 42 MHz, f
IN
= 4.4 MHz 7.2 Bits
f
CLK
= 42 MHz, f
IN
= 21 MHz 6.8 6.1 Bits (min)
SINAD Signal-to-Noise & Distortion
f
CLK
= 30 MHz, f
IN
= 1 MHz 45 dB
f
CLK
= 42 MHz, f
IN
= 4.4 MHz 45 dB
f
CLK
= 42 MHz, f
IN
= 21 MHz 43 38.5 dB (min)
SNR Signal-to-Noise Ratio
f
CLK
= 30 MHz, f
IN
= 1 MHz 44 dB
f
CLK
= 42 MHz, f
IN
= 4.4 MHz 45 dB
f
CLK
= 42 MHz, f
IN
= 21 MHz 44 41 dB (min)
THD Total Harmonic Distortion
f
CLK
= 30 MHz, f
IN
= 1 MHz −57 dB
f
CLK
= 42 MHz, f
IN
= 4.4 MHz −51 dB
f
CLK
= 42 MHz, f
IN
= 21 MHz −46 −41 dB (min)
SFDR Spurious Free Dynamic Range
f
CLK
= 30 MHz, f
IN
= 1 MHz 57 dB
f
CLK
= 42 MHz, f
IN
= 4.4 MHz 54 dB
f
CLK
= 42 MHz, f
IN
= 21 MHz 49 41 dB (min)
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed
specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions.
Note 2: All voltages are measured with respect to GND = AGND = DGND = 0V, unless otherwise specified.
Note 3: When the input voltage at any pin exceeds the power supplies (that is, less than AGND or DGND, or greater than V
A
or V
D
), the current at that pin should
be limited to 25 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of
25 mA to two.
Note 4: The absolute maximum junction temperature (T
J
max) for this device is 150˚C. The maximum allowable power dissipation is dictated by T
J
max, the
junction-to-ambient thermal resistance ( θ
JA
), and the ambient temperature (T
A
), and can be calculated using the formula P
D
MAX = (T
J
max - T
A
)/ θ
JA
. For the 20-pin
TSSOP, θ
JA is 135˚C/W, so P D MAX = 926 mW at 25˚C and 481 mW at the maximum operating ambient temperature of 85˚C. Note that the power dissipation of this
device under normal operation will typically be about 68 mW (40 mW quiescent power + 23 mW reference ladder power + 5 mW due to 1 TTL loan on each digital
output). The values for maximum power dissipation listed above will be reached only when the ADC08351 is operated in a severe fault condition (e.g., when input
or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed). Obviously, such conditions should always be avoided.
Note 5: Human body model is 100 pF capacitor discharged through a 1.5 k Ω resistor. Machine model is 220 pF discharged through ZERO Ohms.
Note 6: See AN-450, “Surface Mounting Methods and Their Effect on Product Reliability”, or the section entitled “Surface Mount” found in any post 1986 National
Semiconductor Linear Data Book, for other methods of soldering surface mount devices.
ADC08351
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