Package outline dimensions, Suggested pad layout – Diodes DMN3018SSS User Manual
Page 5
DMN3018SSS
Document number: DS35501 Rev. 5 - 2
5 of 6
February 2012
© Diodes Incorporated
DMN3018SSS
NEW PROD
UC
T
ADVAN
CE I
N
F
O
RM
ATI
O
N
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1,000
t1, PULSE DURATION TIME (sec)
Fig. 12 Transient Thermal Resistance
R
= r
* R
θJA(t)
(t)
θ
θ
JA
JA
R
= 72 C/W
Duty Cycle, D = t1/t2
°
0.001
0.01
0.1
1
r(t),
T
R
ANSI
E
N
T
T
H
E
R
MA
L
R
ES
IS
T
AN
C
E
D = 0.5
D = 0.7
D = 0.9
D = 0.3
D = 0.1
D = 0.05
D = 0.02
D = 0.01
D = 0.005
D = Single Pulse
Package Outline Dimensions
Suggested Pad Layout
SO-8
Dim
Min
Max
A
-
1.75
A1
0.10
0.20
A2
1.30
1.50
A3
0.15
0.25
b
0.3
0.5
D
4.85
4.95
E
5.90
6.10
E1
3.85
3.95
e
1.27 Typ
h
- 0.35
L
0.62 0.82
θ
0
°
8
°
All Dimensions in mm
Dimensions
Value (in mm)
X
0.60
Y
1.55
C1
5.4
C2
1.27
Gauge Plane
Seating Plane
Detail ‘A’
Detail ‘A’
E
E1
h
L
D
e
b
A2
A1
A
45
°
7
°~
9
°
A3
0.
25
4
X
C1
C2
Y