Maximum ratings q1 n-channel, Maximum ratings q2 p-channel, Thermal characteristics – Diodes DMC2990UDJ User Manual

Page 2

Advertising
background image

DMC2990UDJ

Document number: DS35481 Rev. 9 - 2

2 of 9

www.diodes.com

March 2013

© Diodes Incorporated

DMC2990UDJ

NEW PROD

UC

T

ADVAN

CE I

N

F

O

RM

ATI

O

N

ADVAN

CE I

N

F

O

RM

ATI

O

N

NEW PROD

UC

T





Maximum Ratings Q1 N-CHANNEL

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Units

Drain-Source Voltage

V

DSS

20 V

Gate-Source Voltage

V

GSS

±8 V

Continuous Drain Current (Note 7) V

GS

= 4.5V

Steady

State

T

A

= +25°C

T

A

= +70

C

I

D

450
350

mA

t<5s

T

A

= +25

C

T

A

= +70

C

I

D

520
410

mA

Continuous Drain Current (Note 7) V

GS

= 1.8V

Steady

State

T

A

= +25

C

T

A

= +70

C

I

D

330
260

mA

t<5s

T

A

= +25

C

T

A

= +70

C

I

D

390
310

mA

Maximum Continuous Body Diode Forward Current (Note 7)

I

S

440 mA

Pulsed Drain Current (Note 8)

I

DM

800 mA



Maximum Ratings Q2 P-CHANNEL

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Units

Drain-Source Voltage

V

DSS

-20 V

Gate-Source Voltage

V

GSS

±8 V

Continuous Drain Current (Note 5) V

GS

= -4.5V

Steady

State

T

A

= +25

C

T

A

= +70

C

I

D

-310
-240

mA

t<5s

T

A

= +25

C

T

A

= +70

C

I

D

-360
-280

mA

Continuous Drain Current (Note 5) V

GS

= -1.8V

Steady

State

T

A

= +25

C

T

A

= +70

C

I

D

-240
-190

mA

t<5s

T

A

= +25

C

T

A

= +70

C

I

D

-280
-220

mA

Maximum Continuous Body Diode Forward Current (Note 7)

I

S

-440 mA

Pulsed Drain Current (Note 8)

I

DM

-800 mA



Thermal Characteristics

(@T

A

= +25°C, unless otherwise specified.)

Characteristic Symbol

Value

Units

Total Power Dissipation (Note 7)

P

D

350 mW

Thermal Resistance, Junction to Ambient (Note 7)

Steady State

R

θJA

360 °C/W

t<5s 270

°C/W

Operating and Storage Temperature Range

T

J,

T

STG

-55 to +150

°C

Notes:

7. Device mounted on FR-4 PCB, with minimum recommended pad layout.
8. Device mounted on minimum recommended pad layout test board, 10μs pulse duty cycle = 1%.


















Advertising