Package outline dimensions, Suggested pad layout – Diodes DMC2990UDJ User Manual
Page 8
DMC2990UDJ
Document number: DS35481 Rev. 9 - 2
8 of 9
March 2013
© Diodes Incorporated
DMC2990UDJ
NEW PROD
UC
T
ADVAN
CE I
N
F
O
RM
ATI
O
N
ADVAN
CE I
N
F
O
RM
ATI
O
N
NEW PROD
UC
T
0.001
0.01
0.1
1
0.000001 0.00001
0.0001
0.001
0.01
0.1
1
10
100
1,000
t1, PULSE DURATION TIME (sec)
Fig. 25 Transient Thermal Resistance
D = 0.9
D = 0.7
D = 0.5
D = 0.3
D = 0.1
D = 0.05
D = 0.02
D = 0.01
D = 0.005
D = Single Pulse
R(
t)
, TRANS
IENT THERM
A
L RES
IST
ANCE
R
(t) = r(t)*R
R
= 356C/W
Duty Cycle, D = t1/t2
JA
JA
JA
Package Outline Dimensions
Suggested Pad Layout
SOT963
Dim
Min
Max Typ
A
0.40
0.50 0.45
A1
0
0.05 -
c
0.120
0.180 0.150
D
0.95
1.05 1.00
E
0.95
1.05 1.00
E1
0.75
0.85 0.80
L
0.05
0.15 0.10
b
0.10
0.20 0.15
e
0.35 Typ
e1
0.70 Typ
All Dimensions in mm
Dimensions Value (in mm)
C
0.350
X
0.200
Y
0.200
Y1
1.100
L
c
E
D
e1
e
E1
b (6 places)
A
A1
Y1
Y (6X)
C
C
X (6X)