2 air follow issue, 3 grounding issue – IEI Integration ICE-DB-T6 User Manual
Page 92
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Type 6 Carrier Board Design Guide
Page 82
Figure 5-10: Component Clearances Underneath Module
5.6.2 Air Follow Issue
The air flow of the IEI COM Express fan module must be considered when installing a
COM Express system. Please refer to Figure 5-10 for air flow consideration.
5.6.3 Grounding Issue
The mounting holes on all ICE COM modules are connected to digital circuit ground (GND)
for improved EMC performance. Using conductive screws and distance keepers will also
connect the heatspreader and attached heat sink to GND. In some applications, the heat
sink or heatspreader will be directly screwed with the inner surface of the chassis. In some
cases, it may not be desirable to have a direct connection of circuit ground (GND) and
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