Document Outline

• 1 Introduction
  • 1.1 Introduction
  • 1.2 ICE-QM770 COM Express Module
    • 1.2.1 ICE-QM770 Specifications
  • 1.3 ICE-CV-D25501/N26001 COM Express Module
    • 1.3.1 ICE-CV-D25501/N26001 Specifications
  • 1.4 ICE-DB-T6 Reference Carrier Board
    • 1.4.1 ICE-DB-T6 Specifications
• 2 Pin Assignments
  • 2.1 Chapter Overview
  • 2.2 COM Express Connector Type
  • 2.3 Signal Table Terminology
  • 2.4 Connector Pinout Row A and Row B
  • 2.5 Connector Pinout Rows C and D
• 3 Signal Description and Routing Guideline
  • 3.1 PEG (PCI Express Graphic)
    • 3.1.1 Signal Description
    • 3.1.2 PEG Connector
    • 3.1.3 PEG_ENABLE#
    • 3.1.4 PCI Express Test Points and Probing
    • 3.1.5 PCI Express Routing Guideline
      • 3.1.5.1 Impedance Consideration
      • 3.1.5.2 AC Coupling Capacitors
      • 3.1.5.3 Routing Notices
  • 3.2 PCI Express
    • 3.2.1 Signal Description
    • 3.2.2 PCI Express x1 Slot
    • 3.2.3 PCIe Mini Card
    • 3.2.4 PCI Express Clock Buffer
  • 3.3 SATA (Serial ATA Interface)
    • 3.3.1 Signal Description
    • 3.3.2 SATA Connector
    • 3.3.3 SATA LED#
    • 3.3.4 SATA Routing Guideline
  • 3.4 Universal Serial Bus (USB)
    • 3.4.1 Signal Description
    • 3.4.2 USB Keyed Connector Protocol
    • 3.4.3 ESD/EMI
    • 3.4.4 Over Current Protection
    • 3.4.5 Reference Schematics
    • 3.4.6 USB Routing Guideline
      • 3.4.6.1 Impedance
      • 3.4.6.2 General Routing and Placement
  • 3.5 DDI
    • 3.5.1 Signal Description
    • 3.5.2 DDI Pins and Video Interfaces
      • 3.5.2.1 DDI Signal Description: SDVO
      • 3.5.2.2 DDI Signal Description: DisplayPort
      • 3.5.2.3 DDI Signal Description: HDMI/DVI
  • 3.6 LVDS
    • 3.6.1 Signal Description
    • 3.6.2 LVDS Cable Consideration
    • 3.6.3 Backlight and LCD Power Timing Control
    • 3.6.4 LVDS Routing Guideline
      • 3.6.4.1 Impedance
      • 3.6.4.2 Implement
  • 3.7 Audio Codec Interface (AC’97/HDA)
    • 3.7.1 Signal Description
  • 3.8 Reference Circuit
    • 3.8.1 Audio Routing Guideline
      • 3.8.1.1 Analog Power Delivery
      • 3.8.1.2 Digital and Analog Signals Isolation
      • 3.8.1.3 EMI Consideration
  • 3.9 LAN (Local Area Network)
    • 3.9.1 Signal Description
    • 3.9.2 Giga LAN Connector
    • 3.9.3 LAN Link Activity and Speed LED
    • 3.9.4 LAN Routing Guideline
      • 3.9.4.1 Impedance
      • 3.9.4.2 LAN Ground Plane Separation
  • 3.10 LPC (Low Pin Count Interface)
    • 3.10.1 Signal Description
    • 3.10.2 LPC Super IO for Legacy IO Support
      • 3.10.2.1 Keyboard/Mouse
      • 3.10.2.2 RS-232
  • 3.11 VGA
    • 3.11.1 Signal Description
    • 3.11.2 VGA Connector
    • 3.11.3 VGA DAC Filter
    • 3.11.4 Routing Guide Line
      • 3.11.4.1 HSYNC and VSYNC Signals
      • 3.11.4.2 ESD
      • 3.11.4.3 DDC Interface
    • 3.11.5 VGA Reference Design
  • 3.12 Miscellaneous
    • 3.12.1 Signal Description
    • 3.12.2 Speaker/FAN Control/RTC Reference
      • 3.12.2.1 Speaker Out
      • 3.12.2.2 RTC
      • 3.12.2.3 Fan Control
• 4 PCB Stack and Power Deliver Design
  • 4.1 Chapter Overview
  • 4.2 Microstrip or Stripline
  • 4.3 PCB Stackup Example
    • 4.3.1 Four-Layer Stack-up
    • 4.3.2 Six-Layer Stack-up
  • 4.4 ATX Power Delivery Guidelines
    • 4.4.1 ATX Power States (S0, S3, S4, S5, G3)
    • 4.4.2 ATX Power Diagram
  • 4.5 AT Power Delivery Guideline
• 5 Mechanical Design Guidelines
  • 5.1 Chapter Overview
  • 5.2 COM Module and Carrier Board Connector
    • 5.2.1 Module Connector
    • 5.2.2 Carrier Board Connector
  • 5.3 Connector Footprint
  • 5.4 COM Express Form Factors
  • 5.5 Heat Spread
  • 5.6 Design Notes
    • 5.6.1 Component Height — Module Back and Carrier Board Top
    • 5.6.2 Air Follow Issue
    • 5.6.3 Grounding Issue
  • 5.7 Others Kits Specification
    • 5.7.1 Cooling Kit
• A Terminology
• B Application Notes
  • B.1 Terminology
  • B.2 Updating BIOS Version
    • B.2.1 Using AFUWIN
    • B.2.2 Using DOS Command
  • B.3 RTC Overview
    • B.3.1 How to Calculate the Battery Life
• C Reference Documents
• D Reference Carrier Board Schematic