Power requirements, Module location in the i/o chassis, Module keying – Rockwell Automation 1771-DB Basic Module User Manual - Series A User Manual

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Installing the BASIC Module

Chapter 3

3–2

Your module receives its power through the 1771 I/O chassis backplane
from the chassis power supply. It does not require any other external power
supply to function. When planning your system you must consider the
power usage of all modules in the I/O chassis to prevent overloading the
chassis backplane and/or power supply. Each BASIC module requires 1.5
A at +5V DC. Add this to the requirements of all other modules in the I/O
chassis.

CAUTION: Do not insert or remove modules from the I/O
chassis while system power is on. Failure to observe this rule
may result in damage to module circuitry.

You can place your module in any I/O slot of the I/O chassis except for the
extreme left slot. This slot is reserved for processors or adapter modules.
You can place your module in the same module group as a discrete high
density module if you are using processors or adapters with single-slot
addressing capabilities.

Important: Certain processors restrict the placement of block-transfer
output modules. Refer to the user manual for your particular processor for
more information.

Initially you can insert your module into any I/O module slot in the I/O
chassis. However, once you designate a slot for a module you must not
insert other modules into these slots. We strongly recommend that you use
the plastic keying bands shipped with each I/O chassis, to key I/O slots to
accept only one type of module. Your module is slotted in two places on
the rear edge of the board. The position of the keying bands on the
backplane connector must correspond to these slots to allow insertion of
the module. You may key any I/O rack connector to receive the module
assembly. Snap the keying bands onto the upper backplane connectors
between the numbers printed on the backplane (figure 3.1).

Between 8 and 10

Between 32 and 34

3.2.1
Power Requirements

3.2.2
Module Location in the I/O
Chassis

3.2.3
Module Keying

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