Rockwell Automation T8300 Trusted Expander Chassis - Manual (Page 8)

Trusted
TM
Expander Chassis T8300
Issue 13 Jul 12 PD-T8300 8
1.1. Inter-Module Bus Backplane
The Chassis houses the Inter-Module Bus backplane which is a single, printed circuit board assembly.
The Inter-Module Bus backplane provides the electrical interconnections between modules in a
Trusted
TM
Expander Chassis. These interconnections are part of the physical layer communications
between modules.
Figure 2 shows a simplified top-level block diagram of the Inter-Module Bus backplane.
Figure 2 Inter-Module Bus Backplane
PWR
Connections Slot
Connection Slot
Connection Slot
Connection Slot
Connection
Chassis
Configuration
DIP switches
Trusted
Expander
Processor
1
Trusted
IO Module
12
Triplicated Inter-Module Bus
External +24Vdc
Power Supplies
Backplane
Bus Termination
Components Bus Termination
Components
Dual Redundant
Power Rails
Trusted
Expander
Processor
(Hot Swap Slot)