Major components (ics), 2 major components (ics) – ADLINK LEC-iMX6 User Manual

Page 6

Advertising
background image

2

Overview

1.2 Major Components (ICs)

Table 1-1 lists the major integrated circuits on the LEC-iMX6, including a brief description of
each IC. Figure 1-2 and Figure 1-3 show the locations of the major ICs.

Figure 1-2: Component Locations (Top Side)

Table 1-1: Major Integrated Circuit Descriptions and Functions

Chip Type

Mfg.

Model

Description

Function

CPU (U1)

Freescale
Semiconductor

i.MX 6Solo (one core)
i.MX 6Dual (two cores)
i.MX 6DualLite
(two cores, no SATA)
i.MX 6Quad (four cores)

800 MHz, ARM
Cortex-A8, 40nm SoC
(System on Chip)

Integrates
Processor
Core, Graphics
and Memory
Controller Hub,
and I/O Hub

DDR3L
SDRAM (U7,
U8, U9, U10
[U8 and U10
on bottom
side])

Micron

MT41K256M16HA

On-board DDR3L,
1.35V, 4Gb,
32Mx16x8 System
Memory

Provides
high-speed
data transfer

Ethernet
PHY
Transceiver
(U11)

Atheros

AR8035-AL1B-R

Integrated 10/100/
1000 Mbps
single-port, tri-speed
Ethernet PHY
Transceiver

Provides a
standard IEEE
802.3 Ethernet
interface for
Ethernet
transfer rates
up to 1000
Mbps

eMMC,
NAND Flash
(U16 - on
bottom side)

Micron

MTFC8GLDEA-4M-IT

MultiMediaCard
Controller and NAND
Flash Memory up to
64GB

Provides
communication
and mass data
storage
capabilities

U7

U9

U1

Key:
U1
- CPU
U7 - DDR3L SDRAM
U9 - DDR3L SDRAM
U11 - Ethernet Controller

LEC_iMX6_T

op_Comp_a

1 2

U11

Advertising