Linx Technologies LICAL-EDC-DS - Manual (Page 11)

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Recommended Pad Layout
The DS Series encoder/decoder is implemented in a 28-pin Shrink Small
Outline Package (28-SSOP). The recommended layout dimensions are in
Figure 17.
Production Guidelines
These surface-mount components are designed to comply with standard
reflow production methods. The recommended reflow profile is shown in
Figure 18 and should not be exceeded, as permanent damage to the part
may result.
0.071
(1.80)
0.016
(0.40)
0.026
(0.65)
0.283
(7.20)
Figure 17: Recommended Footprint
240°C Max
0
25
50
75
100
125
150
175
200
225
250
TEMPERATURE (°C)
275
0 20 40 60 80 100 120 140 160 180 200 220 240 260 280 300 320
TIME (SECONDS)
340 360 380 420 400
260°C Max
Lead-Free
Sn / Pb
Figure 18: Recommended Solder Profile
Helpful Application Notes from Linx
It is not the intention of this manual to address in depth many of the issues
that should be considered to ensure that the modules function correctly
and deliver the maximum possible performance. As you proceed with your
design, you may wish to obtain one or more of the following application
notes which address in depth key areas of RF design and application of
Linx products. These application notes are available online at
www.linxtechnologies.com or by contacting Linx.
Helpful Application Note Titles
Note Number Note Title
AN-00300 Addressing Linx OEM Products
AN-00310 Encoder and Decoder Comparison
AN-00320 The Basics of Remote Control and Remote Keyless Entry
Figure 19: Helpful Application Notes