Linx Technologies LICAL-ENC-MS001 - Manual (Page 10)

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Recommended Pad Layout
The MS Series encoders and decoders are implemented in an industry
standard 20-pin Shrink Small Outline Package (20-SSOP). The
recommended layout dimensions are shown in Figure 12.
Production Considerations
These surface-mount components are designed to comply with standard
reflow production methods. The recommended reflow profile is shown in
Figure 13 and should not be exceeded, as permanent damage to the part
may result.
0.047
(1.19)
0.016
(0.41)
0.026
(0.65)
0.328 (8.33)
0.234 (5.94)
Figure 12: PCB Layout Dimensions
240°C Max
0
25
50
75
100
125
150
175
200
225
250
TEMPERATURE (°C)
275
0 20 40 60 80 100 120 140 160 180 200 220 240 260 280 300 320
TIME (SECONDS)
340 360 380 420 400
260°C Max
Lead-Free
Sn / Pb
Figure 13: MS Series Reflow Profile
Resources
Support
For technical support, product documentation, application notes, regulatory
guidelines and software updates, visit www.linxtechnologies.com
RF Design Services
For customers who need help implementing Linx modules, Linx offers
design services including board layout assistance, programming,
certification advice and packaging design. For more complex RF solutions,
Apex Wireless, a division of Linx Technologies, creates optimized designs
with RF components and firmware selected for the customer’s application.
Call +1 800 736 6677 (+1 541 471 6256 if outside the United States) for
more information.
Antenna Factor Antennas
Linx’s Antenna Factor division has the
industry’s broadest selection of antennas
for a wide variety of applications. For
customers with specialized needs, custom antennas and design services
are available along with simulations of antenna performance to speed
development. Learn more at www.linxtechnologies.com.
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