Texas Instruments MSP50C614 - Manual (Page 384)

Mechanical Information
7-2
7.1 Mechanical Information
The C614 is normally sold in die form but is also available in 100-pin PJM
packages. The P614 is available in a windowed ceramic package, 120-pin
PGA.
NOTE: Scan Port Bond Out
The Scan Port Interface on the MSP50C6xx devices has five dedicated pins
and one shared pin that need to be used by the MSP50Cxx development
tools. The SCANIN, SCANOUT, SCANCLK, SYNC, and TEST pins are
dedicated to the scan port interface. The RESET pin is shared with the
application. These pins may play an important role in debugging any system
problems. For this reason, these pins MUST be bonded out on any C614
production board. Furthermore, it is recommended that these pins be
connected to test points, so the development tool can be connected. Since
the development tool requires V
DD
and V
SS
, test points connected these
signals are also needed.
The application circuits appearing in section 6.1 show the minimum
recommended configuration for any C614 application board. For production
purposes the 10 k
Ω
resistor which appears at the RESET pin is optional. It is
required for use with the Scan Port Interface, but they may be shorted
otherwise. The footprints for this resistor is strongly recommended.
7.1.1 Die Bond-Out Coordinates
Die bond-out coordinates are available upon request from Texas Instruments.