PNI ASIC User Manual

Pni asic, General description, Features

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Table of contents

Document Outline

General Description
Features
Applications
- Parameter
  - Parameter voltage and current levels
    - Vila
    - Iilb
    - Vol
    - Iola
    - 5 VDC
    - 1
    - 26
    - VSTBY
    - DP
    - VDD
    - Input protection clamp diode. Connect to VDD
    - 2
    - 27
    - SCLK
    - DI
    - IBT
    - Serial Clock input for SPI port. 1 MHz maximum (Rext = 100 kHz)
    - 3
    - 28
    - MISO
    - DO
    - OB2
    - Serial data output (Master In Slave Out)
    - 4
    - 1
    - MOSI
    - DI
    - IBA
    - Serial data output (Master Out Slave In)
    - 5
    - 3
    - SSNOT
    - DI
    - IBA
    - Active low chip select for SPI port
    - ---
    - 2
    - Not Connected
    - 6
    - 4
    - AVDD
    - AP
    - VDD
    - Supply voltage for analog section
    - 7
    - 5
    - AVSS
    - AP
    - VSS
    - Ground pin for analog section
    - 8
    - 6
    - +ZDRV
    - DO
    - OB3
    - Z sensor drive output
    - 9
    - 7
    - +ZIN
    - AI
    - AIB
    - Z sensor sense input
    - 10
    - 8
    - -ZIN
    - AI
    - AIB
    - Z sensor sense input
    - 11
    - 9
    - -ZDRV
    - DO
    - OB3
    - Z sensor drive output
    - 12
    - 10
    - +YDRV
    - DO
    - OB3
    - Y sensor drive output
    - 13
    - 11
    - +YIN
    - AI
    - AIB
    - Y sensor input
    - 14
    - 12
    - DVDD
    - DP
    - VDD
    - Supply voltage for digital section
    - 15
    - 13
    - -YIN
    - AI
    - AIB
    - Y sensor input
    - 16
    - 14
    - -YDRV
    - DO
    - OB3
    - Y sensor drive output
    - 17
    - 15
    - +XDRV
    - DO
    - OB3
    - X sensor drive output
    - 18
    - 16
    - +XIN
    - AI
    - AIB
    - X sensor sense input
    - 19
    - 17
    - -XIN
    - AI
    - AIB
    - X sensor sense input
    - 20
    - 18
    - -XDRV
    - DO
    - OB3
    - X sensor drive output
    - 21
    - 19
    - DVSS
    - DP
    - VSS
    - Ground pin for digital section
    - ---
    - 20
    - Not connected
    - 22
    - 21
    - COMP
    - DO
    - OB1
    - Comparator output. Used for diagnostics.
    - 23
    - 22
    - RESET
    - DI
    - IBA
    - Rest input
    - 24
    - 23
    - DRDY
    - DO
    - OB1
    - Data ready
    - 25
    - 24
    - DHST
    - DIO
    - IOIA
    - High speed oscillator output. Output is ½ clock speed. Use for diagnostics
    - 26
    - 25
    - REXT
    - AI
    - AIB
    - External timing resistor for high speed clock. 100 k ohm typical
    - Exposed Paddle (center Pad)
    - Connect to analog ground
  - MOSI – Master Out Slave In
  - SSNOT – Slave Select
  - SCLK – Serial Clock
  - MISO – Master In Slave Out
  - RESET
  - DRDY – Data Ready
    - Maximum Delay
    - SEN-S (3 VDC)
    - /32
    - 500µS
    - /64
    - 1.0 mS
    - /128
    - 2.0 mS
    - /256
    - 4.0 mS
    - /512
    - 7.5 mS
    - /1024
    - 15 mS
    - /2048
    - 35.5 mS
    - /4096
    - 60 mS
      - Operation
      - SPI Port Usage Tips
      - Idle Mode
      - Magnetic Measurements
      - Command Byte
    - Position
    - Bit
    - DHST
    - PS2
    - PS1
    - PS0
    - ODIR
    - MOT
    - ASI
    - ASO
    - RESET
    - 0
    - 0
    - 0
    - 0
    - 0
    - 0
    - 0
    - 0
  - DHST – High Speed Oscillator Test
  - PS0, PS1, and PS2 – Period Select
    - PS2
    - PS1
    - PS0
    - Ratio
    - 0
    - 0
    - 0
    - /32
    - 0
    - 0
    - 1
    - /64
    - 0
    - 1
    - 0
    - /128
    - 0
    - 1
    - 1
    - /256
    - 1
    - 0
    - 0
    - /512
    - 1
    - 0
    - 1
    - /1024
    - 1
    - 1
    - 0
    - /2048
    - 1
    - 1
    - 1
    - /4096
  - ODIR – Oscillator Direction
  - MOT – Magnetic Oscillator Test
  - ASO & ASI – Axis Select
    - Function
    - AS1
    - AS0
    - 2 MHz scaling
    - 0
    - 0
    - X axis
    - 0
    - 1
    - Y axis
    - 1
    - 0
    - Z axis
    - 1
    - 1
      - Response Word
      - Pin Configuration
      - 28 Lead MLF (5 x 5 mm) Outline Dimensions
      - 28 Lead MLF (5 x 5 mm) Tape & Reel Dimensions
      - Die Package Mechanical Specifications
      - Die Package Mechanical Specifications
    - Pad
    - Function
    - X (mm)
    - Y (mm)
    - 1
    - VSTBY
    - –655
    - 968
    - 2
    - SCLK
    - –755
    - 968
    - 3
    - MISO
    - –893
    - 968
    - 4
    - MOSI
    - –1012
    - 968
    - 5
    - SSNOT
    - –1128
    - 968
    - 6
    - AVDD
    - –1125
    - 226
    - 7
    - AVSS
    - –1125
    - 62
    - 8
    - APZDRV
    - –1125
    - –81
    - 9
    - APZIN
    - –1134
    - –966
    - 10
    - ANZIN
    - –1012
    - –966
    - 11
    - ANZDRV
    - –893
    - –966
    - 12
    - APYDRV
    - –448
    - –966
    - 13
    - APYIN
    - –3
    - –966
    - 14
    - DVDD
    - 115
    - –966
    - 15
    - ANYIN
    - 237
    - –966
    - 16
    - ANYDRV
    - 357
    - –966
    - 17
    - APXDRV
    - 802
    - –966
    - 18
    - APXIN
    - 1118
    - –403
    - 19
    - ANXIN
    - 1118
    - –312
    - 20
    - ANXDRV
    - 1118
    - –189
    - 21
    - DVSS
    - 1118
    - 225
    - 22
    - COMP
    - 1126
    - 968
    - 23
    - RESET
    - 1008
    - 968
    - 24
    - DRDY
    - 887
    - 968
    - 25
    - DHST
    - 768
    - 968
    - 26
    - REXT
    - 650
    - 968
      - Recommended Processing Parameters
    - Reflow Parameter
    - Temperature (°C)
    - Time (sec)
    - Preheat Temperature (TSmin to TSmax)
    - 150°C – 200°C
    - 60-180
    - Temperature TL (typical solder melting point)
    - >218°C
    - TSmax to TL Ramp-up Rate
    - 3°C/second max
    - Peak Temperature TP
    - 260°C
    - Time 25°C to Peak TP
    - 6 minute max
    - Time Maintained Above Temperature TL (tL)
    - 218°C
    - 60-120
    - Soak (time within 5° of actual Peak TP)
    - 10-20
    - Ramp-down Rate
    - 4°C/second max

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