Lanner LEC-3100 - Manual (Page 3)

1
Introduction
Chapter 1
Embedded and Industrial Computing
Chapter 1:
Introduction
Thank you for choosing the LEC-3100 The LEC-3100
is an embedded automation computer that features
fanless rackmount design targeted for high demand
serial port connectivity in an industrial environment or
transportation control system.
The LEC-3100’s CPU core consists of an Intel 945GSE with
ICH7M chipset mounted on its bottom side, an approach
that improves thermal management and increases the
space for I/O functions and connectors This innovative
design has enabled the LEC-3100 to integrate additional
COM ports (a total of 10 RS232/RS485/RS422 configurable
ports and all are capable of automatic flow control by
hardware and isolation) and 5 Ethernet controllers, 4
digital inputs and 4 digital outputs, 4 USB2 0 ports, one
DVI display, and a PCI-104 expansion stack location
Please refer to the chart below for a detailed description
of the system’s specifications
System Specification
FEATURE DESCRIPTION LEC-3100
Platform
Form Factor 1U Rackmount
Processor Intel Atom N270
Chipset Intel 945GSE + ICH7M
BIOS AMIBIOS with 8Mbit FWH
Max. FSB 533MHz
Memory
Memory IC On Board No
Memory Socket
1 x SODIMM (up to 2GB per
slot)
Max Memory 2GB (1 x 2GB Module)
Storage
Compact Flash 1 x CF Socket Type I/II
SATA 1 x 2.5” SATA HDD
IDE 2 x 22pin IDE header
Networking Controller (Interface)
Intel 82574L x 4,
Intel 82562GZ x1
Video Controller Onboard 945GSE
Audio Codec ALC888 HD Codec
I/O
COM Ports
2 x DB9
8 x Phoenix Contact
All ports are isolated and can
use RS-232/422/485 control
signals Corresponding LEDs
on front panel
USB 2.0 4 (3 x External, 1 x Internal)
DVI 1 (1600 x 1200)
LAN
1x RJ45 FE and 4 x RJ45 GbE,
LEDs on front panel
Audio
Line in, Line out, Mic In
(optional)
DIO
4 in, 4 out, LEDs on front
panel
Expansion PCI/104
Hardware
Monitor
Controller
Winbond W83627 UHG inte-
grated hardware monitor
Watchdog timer Yes (1~255 level)
OS Sup-
ported
Embedded Windows XP/Linux
kernel 2.4.16 or above/Win-
dowsXP 32 bit
Environmen-
tal Param-
eters
Operating Temperature
(With Industrial Compo-
nents:
CF, Memory, SSD, HDD)
-20°~50°C / 14°~131°F
Operating Temperature
(With Commercial Com-
ponents)
-5°C~45°C / 23°~113°F
Extended Operating
Temperature Tested
N/A
Dimensions
W x H x D 271 x 44.5 x 440 mm
Weight 3Kg