0 package and pinout information, 1 device identification, Package and pinout information – Intel 82540EP User Manual
Page 33: Device identification
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Networking Silicon — 82540EP
Datasheet
27
5.0
Package and Pinout Information
This section describes the 82540EP device, manufactured in a 196-lead ball grid array measuring
15mm X 15mm. External product identification is shown in
. The nominal ball pitch is
1mm. The pin number-to-signal mapping is indicated beginning with
5.1
Device Identification
NOTE: “
•
“indicates the location of pin 1. It is not an actual mark on the device
Figure 10. 82540EP Device Identification Markings
82540EP
Product Name
YYWW
Date Code
Tnnnnnnnn
Lot Trace Code
(c)’ZZ
Copyright Information
Country
Country of Origin Assembly
RC82540EP
YYWW © 'ZZ
Tnnnnnnnn
Country
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