0 package and pinout information, 1 device identification, Package and pinout information – Intel 82540EP User Manual

Page 33: Device identification

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Networking Silicon — 82540EP

Datasheet

27

5.0

Package and Pinout Information

This section describes the 82540EP device, manufactured in a 196-lead ball grid array measuring
15mm X 15mm. External product identification is shown in

Figure 10

. The nominal ball pitch is

1mm. The pin number-to-signal mapping is indicated beginning with

Table 19

.

5.1

Device Identification

NOTE:

“indicates the location of pin 1. It is not an actual mark on the device

Figure 10. 82540EP Device Identification Markings

82540EP

Product Name

YYWW

Date Code

Tnnnnnnnn

Lot Trace Code

(c)’ZZ

Copyright Information

Country

Country of Origin Assembly

RC82540EP
YYWW © 'ZZ
Tnnnnnnnn
Country

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