2 package information, Package information – Intel 82540EP User Manual

Page 34

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82540EP — Networking Silicon

28

Datasheet

5.2

Package Information

The 82540EP device is a 196-lead ball grid array (TFBGA) measuring 15 mm

2

. The package

dimensions are detailed in

Figure 11

. The nominal ball pitch is 1 mm.

Figure 11. 82540EP Mechanical Specifications

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