Samsung SCLSeries - Manual (Page 9)

SCL Series
NO ITEMS TEST CONDITION PERFORMANCE
12
SOLDERABILITY
[Pb-free]
SOLDER TEMPERATURE : 245±5℃
DIP TIME : 3±0.5 SEC.
SOLDER : Sn-3Ag-0.5Cu
FLUX : ROSIN(KSM2951)+Solvent(ISA)
(ROSIN 25WT%)
MORE THAN 95% OF THE
TERMINAL SURFACE MUST BE
SOLDERED NEWLY.
13
RESISTANCE
TO SOLDERING
HEAT
PREHEAT : 100∼110℃ FOR 30 SEC.
TEMPERATURE : 260±5℃
DIP TIME : 10 ±1 SEC
ALL SAMPLES SHALL BE DIPPED IN SOLDER
BATH. MEASUREMENT SHALL BE MADE AT
ROOM TEMPERATURE AFTER 1~2 HOURS OF
COOLING TIME.
CHANGE IN CAPACITANCE :
±5% OF INITIAL VALUE
TANGENT OF LOSS ANGLE :
LEAKAGE CURRENT :
APPEARANCE :
THERE SHALL BE NO EVIDENCE
OF MECHANICAL DAMAGE. .
CONVECTION REFLOW
PREHEAT : 150∼190℃ FOR 130 SEC.
PEAK TEMPERATURE : 260±5℃ FOR 10 SEC.
METHOD : SAMPLES SHALL BE PASSED
REFLOW 3 TIMES.
MEASUREMENT SHALL BE MADE AT ROOM
TEMPERATURE AFTER 3∼4 HOURS OF
COOLING TIME.
Change in capacitance:
±10% of initial value
Tangent of loss angle:
Leakage Current :
14
RESISTANCE
TO
CLEAN TEST
IMMERSION CLEANING
THE CAPACITOR SHALL BE CLEANED AT
ROOM TEMPERATURE FOR 60sec. USING
ISOPROPYL ALCOHOL
THERE SHALL BE NO EVIDENCE
OF MECHANICAL DAMAGE. AND
MARKING SHALL BE LEGIBLE.
ELECTRICAL CHARACTERISTICS
SHALL SATISFY THE INITIAL
REQUIREMENT.
15
VIBRATION FREQUENCY : 10 to 55 to 10Hz (in 1 min.) MAX
AMPLITUDE : 1.5 mm.
DIRECTION OF VIBRATION : IN DIRECTION OF
X,Y AND Z AXES
TIME : 2 HOURS EACH DIRECTION AND 6
HOURS IN TOTAL
DURING THE LAST 30 min. OF VIBRATION IN
EACH DIRECTION, THE CAPACITANCE SHALL
BE MEASURED 3 TO 5 TIMES.
FOR OTHER PROCEDURES REFER TO IEC
Pub. 68-2-6.
MOUNTING METHOD
SOLDER
ALUMINA
BOARD
CHANGE IN CAPACITANCE :
WITHIN : ±5% OF THE INITIAL
VALUE
TANGENT OF LOSS ANGLE :
LEAKAGE CURRENT :
APPEARANCE :
THERE SHALL BE NO EVIDENCE
OF MECHANICAL DAMAGE. .