Thermal characteristics, Tfa9812, Nxp semiconductors – NXP Semiconductors TFA9812 User Manual

Page 43

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TFA9812_2

© NXP B.V. 2009. All rights reserved.

Preliminary data sheet

Rev. 02 — 22 January 2009

43 of 66

NXP Semiconductors

TFA9812

BTL stereo Class-D audio amplifier with I

2

S input

[1]

V

ss

= V

SS1

= V

SS2

= REFA = REFD

12. Thermal characteristics

[1]

Measured in a JEDEC high K-factor test board (standard EIA/JESD 51-7).

[2]

Measured in free air with natural convection.

[3]

Strongly depends on where measurement is made on the case: worst-case value stated.

V

x

voltage on pin x

DIAG

[1]

V

SS

0.3

V

SS

+ 12

V

POWERUP

[1]

V

SS

0.3

V

DDA

+ 0.3

V

ENABLE, GAIN, CSEL,
ADSEL2/PLIM2,
ADSEL2/PLIM1, SCL/SFOR,
SDA/MS, DATA, WS, BCK,
MCLK

[1]

V

SS

0.5

V

SS

+ 5.5

V

AVOL

[1]

V

SS

0.5

V

SS

+ 4.6

V

V

esd

electrostatic discharge voltage

according to the human body model

STAB1 and STAB2 with
respect to other pins

1750

+1750

V

all other pins

2

+2

kV

according to the charge
device model

500

+500

V

Table 53.

Limiting values

…continued

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

Table 54.

Thermal Characteristics

Symbol

Parameter

Condition

Min Typ

Max Unit

R

th(j-a)

thermal resistance
from junction to
ambient

No air flow, JEDEC board

[1][2]

-

-

42

K/W

No air flow; typical 4L board in
the NXP 4L reference
application

[2]

-

-

36

K/W

No air flow; typical 2L board in
the NXP 2L reference
application

[2]

-

-

42

K/W

R

th(j-c)

thermal resistance
from junction to case

[3]

5

-

-

K/W

R

th(j-lead)

thermal resistance
from junction to lead

Worst-case pin

5

-

-

K/W

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