NXP Semiconductors Triple high-speed Analog-to-Digital Converter 110 Msps TDA8752B - Manual (Page 38)

© Philips Electronics N.V. 2000. Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 21 July 2000 Document order number: 9397 750 07338
Contents
Philips Semiconductors
TDA8752B
Triple high-speed Analog-to-Digital Converter 110 Msps
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
5 Ordering information . . . . . . . . . . . . . . . . . . . . . 3
6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
7 Pinning information . . . . . . . . . . . . . . . . . . . . . . 7
7.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
7.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 8
8 Functional description . . . . . . . . . . . . . . . . . . 11
8.1 IC analog video inputs . . . . . . . . . . . . . . . . . . 11
8.2 Clamps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
8.3 Variable gain amplifiers . . . . . . . . . . . . . . . . . 11
8.4 ADCs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
8.5 ADC outputs . . . . . . . . . . . . . . . . . . . . . . . . . . 13
8.6 Phase-locked loop . . . . . . . . . . . . . . . . . . . . . 13
8.7 I 2 C-bus and 3-wire serial bus interface. . . . . . 16
9 I 2 C-bus and 3-wire serial bus interfaces . . . . 17
9.1 Register definitions . . . . . . . . . . . . . . . . . . . . . 17
9.1.1 Offset register . . . . . . . . . . . . . . . . . . . . . . . . . 17
9.1.2 Coarse and fine registers . . . . . . . . . . . . . . . . 18
9.1.3 Control register . . . . . . . . . . . . . . . . . . . . . . . . 19
9.1.4 VCO register . . . . . . . . . . . . . . . . . . . . . . . . . . 19
9.1.5 Divider register . . . . . . . . . . . . . . . . . . . . . . . . 21
9.1.6 Power-down mode . . . . . . . . . . . . . . . . . . . . . 21
9.1.7 PHASEA and PHASEB registers . . . . . . . . . . 21
9.2 I 2 C-bus protocol . . . . . . . . . . . . . . . . . . . . . . . 22
9.3 3-wire serial bus protocol . . . . . . . . . . . . . . . . 23
10 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 24
11 Thermal characteristics. . . . . . . . . . . . . . . . . . 24
12 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 24
13 Application information. . . . . . . . . . . . . . . . . . 31
14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 32
15 Handling information. . . . . . . . . . . . . . . . . . . . 33
16 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
16.1 Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
16.2 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 33
16.3 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 33
16.4 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 34
16.5 Package related soldering information . . . . . . 34
17 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 35
18 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 36
19 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
20 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
21 Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36