Asus P5BV-C User Manual

Page 17

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ASUS P5BV-C Series

1-3

PCI Express™ interface

The motherboard fully supports PCI Express, the latest I/O interconnect technology

that speeds up the PCI bus. PCI Express features point-to-point serial

interconnections between devices and allows higher clockspeeds by carrying data

in packets. This high speed interface is software compatible with existing PCI or

PCI-X specifications. See page 2-18 for details.

Gigabit LAN solution

The motherboard comes with dual Gigabit LAN controllers and ports to provide a

total solution for your networking needs. The onboard Marvell 88E8056 Gigabit

LAN controllers use the PCI Express interface and could achieve network

throughput close to Gigabit bandwidth. See page 2-22 for details.

Serial ATA II technology

The motherboard supports the Serial ATA II technology through the Serial ATA

interfaces controlled by the Intel

®

ICH7R. The SATA specification allows for thinner,

more flexible cables with lower pin count, reduced voltage requirement, and up to

300 MB/s data transfer rate.

Built-in SATA RAID solution

The Intel

®

ICH7R allows RAID 0, RAID 1, RAID 10, and RAID 5 configuration for

SATA hard disk drives via the Intel

®

Matrix Storage Manager (under Windows

Operating System) or the LSI Logic Embedded SATA RAID Setup Utility (no RAID

5). See page 2-25 and Chapter 5 for details.

USB 2.0 technology

The motherboard implements the Universal Serial Bus (USB) 2.0 specification,

dramatically increasing the connection speed from the 12 Mbps bandwidth on USB

1.1 to a fast 480 Mbps on USB 2.0. USB 2.0 is backward compatible with USB 1.1.

See pages 2-22 and 2-26 for details.

Temperature, fan, and voltage monitoring

The CPU temperature is monitored by the ASIC (integrated in the Winbond

hardware monitor) to prevent overheating and damage. The system fan Rotations

Per Minute (RPM) is monitored for timely failure detection. The ASIC monitors the

voltage levels to ensure stable supply of current for critical components. See page

4-31 for details.

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