Package dimensions, Thermal characteristics, Cs2100-cp – Cirrus Logic CS2100-CP User Manual
Page 31
CS2100-CP
DS840F2
31
10.PACKAGE DIMENSIONS
Notes: 1. Reference document: JEDEC MO-187
2.
D does not include mold flash or protrusions which is 0.15 mm max. per side.
3.
E1 does not include inter-lead flash or protrusions which is 0.15 mm max per side.
4.
Dimension b does not include a total allowable dambar protrusion of 0.08 mm max.
5.
Exceptions to JEDEC dimension.
THERMAL CHARACTERISTICS
INCHES
MILLIMETERS
NOTE
DIM
MIN
NOM
MAX
MIN
NOM
MAX
A
--
--
0.0433
--
--
1.10
A1
0
--
0.0059
0
--
0.15
A2
0.0295
--
0.0374
0.75
--
0.95
b
0.0059
--
0.0118
0.15
--
0.30
4, 5
c
0.0031
--
0.0091
0.08
--
0.23
D
--
0.1181 BSC
--
--
3.00 BSC
--
2
E
--
0.1929 BSC
--
--
4.90 BSC
--
E1
--
0.1181 BSC
--
--
3.00 BSC
--
3
e
--
0.0197 BSC
--
--
0.50 BSC
--
L
0.0157
0.0236
0.0315
0.40
0.60
0.80
L1
--
0.0374 REF
--
--
0.95 REF
--
Parameter
Symbol
Min
Typ
Max
Units
Junction to Ambient Thermal Impedance
JEDEC 2-Layer
JEDEC 4-Layer
θ
JA
θ
JA
-
-
170
100
-
-
°C/W
°C/W
10L MSOP (3 mm BODY) PACKAGE DRAWING (
E
N
1 2 3
e
b
A1
A2
A
D
SEATING
PLANE
E1
1
L
SIDE VIEW
END VIEW
TOP VIEW
∝
L1
c