Rockwell Automation Safety Guidelines for the Application, Installation, and Maintenance of Solid-State Control - Manual (Page 20)

Publication SGI-1.1 - August 2009
20 Section 4: Installation Guidelines
When installing a system using solid-state technology it is wise to assume
that electrical noise exists and install the equipment in accordance with the
recommended guidelines to minimize problems.
See also section 3.4.1.
4.2 Enclosures Suitable enclosures and control of the maximum operating temperature, both
of which are environmental variables, may be needed to prevent malfunction
of solid state control.
The manufacturer's recommendations should be followed for the selection of
enclosures, ventilation, air filtering (if required), and ambient temperature.
These recommendations may vary from installation to installation, even within
the same facility.
Comments: 4.2 — Enclosures (Cooling and Ventilating)
NEMA Standards Publication No. 250 (please reference the latest edition),
classifies enclosures by type number and specifies their design test
requirements.Suitable enclosures and control of the maximum operating
temperature, both of which are environmental variables, may be needed to
prevent malfunctions of solid-state control.
See also sections 2.1 and 3.6.1.
4.3 Special Handling of
Electrostatic Sensitive
Devices Some devices may be damaged by electrostatic charges. These devices are
identified and should be handled in the special manner specified by the
manufacturer.
NOTE: Plastic wrapping material used to ship these devices may be
conductive and should not be used as insulating material.
Comments: 4.3 — Special Handling of Electrostatic Sensitive Devices
Many problems due to electrostatic discharge (ESD) occur due to
handling of modules during installation or maintenance.
In addition to specific guidelines provided by an equipment supplier, the
following general guidelines can help reduce damage due to ESD.
1. Use a grounding bracelet if possible to minimize charge build-up on
personnel.
2. Handle a module by the edges without touching components or printed
circuit paths.
3. Store modules with ESD sensitive components in the conductive
packaging used for shipping the modules. Also, use conductive
packaging when returning static sensitive modules for repair.