Replacing the processor – Dell Inpsiron 560s (Late 2009) User Manual

Page 16

Advertising
background image

 

Replacing the Processor

 

 

 

1.

Follow the procedures in

Before You Begin

.


 

2.

Unpack the new processor, being careful not to touch the underside of the processor. 

 

 

3.

If the release lever on the socket is not fully extended, move it to that position.

 

4.

Orient the front and rear alignment-notches on the processor with the front and rear alignment-notches on the socket.

 

5.

Align the pin-1 corners of the processor and socket.

 

 

6.

Set the processor lightly in the socket and ensure that the processor is positioned correctly.

 

7.

When the processor is fully seated in the socket, close the processor cover.

Ensure that the tab on the processor cover is positioned underneath the center cover latch on the socket.

 

8.

Pivot the socket release lever back toward the socket, and snap it into place to secure the processor.

 

9.

Clean the thermal grease from the bottom of the heat sink.

 

 

10.

Apply the new thermal grease to the top of the processor.

 

11.

Replace the processor fan and heat sink assembly (see

Replacing the Processor Fan and Heat Sink Assembly

).

 

CAUTION:

Ground yourself by touching an unpainted metal surface on the back of the computer.

CAUTION:

When replacing the processor, do not touch any of the pins inside the socket or allow any objects to fall on the pins in the socket.

CAUTION:

You must position the processor correctly in the socket to avoid permanent damage to the processor and the computer when you turn

on the computer.

CAUTION:

To avoid damage, ensure that the processor aligns properly with the socket, and do not use excessive force when you install the

processor.

1 front alignment notch 2 processor pin-1 indicator 3 rear alignment notch

4 processor cover

5 center cover latch

6 processor

7 socket

8 tab

9 release lever

CAUTION:

Ensure that you apply new thermal grease. New thermal grease is critical for ensuring adequate thermal bonding, which is a

requirement for optimal processor operation.

Advertising