Thinklogical SDIXtreme 3G and 3G+ Manual - Manual (Page 7)

Revision E 7 July 2012
Technical Specifications
Indicators:
(3) Power, Data Rate SD, HD, 3G – Lock Detect - Active
Dimensions: 3G = 4.96 x 2.25 x 1.03 (in) – 125.98 x 57.12 x 26.14 (mm)
3G+ = Height: 1.68” (4.3cm) Depth: 3.427” (8.7cm) Width: 5.609”
(14.25 cm)
3G+ RM = Rack Size: EIA 19" Height: 1U-1.72” (4.40 cm) Depth:
18.02" (45.8 cm) Width: 17.49" (44.5 cm)
(Tolerance: ± .039"; .100cm)
Weight: 3G = ~ 1 lb. (~0.45 kg.)
3G+ = <1lb (0.45kg) each Shipping Weight: 4lb (1.81kg) pair
3G+ RM = 15 lbs (4.99 kg) per unit Shipping Weight: 30 lbs (12.25
kg) pair
Supply Voltage 3G and 3G+= 5-14 VDC
3G+ RM =90-264 VAC, 47-63 Hz, Universal AC Power Supplies
Power Consumption: 3G and 3G+ = 6 Watts per unit
3G+ RM = 30 Watts fully loaded per unit
Operating Temperature: 0º C to +50º C; (32°-122°F)
TRANSMITTER Specifications:
Number of SDI Inputs
1 - 2
Data Rate Range 270Mbps to 2.97 Gbps
Supported Standards SMPTE 424M, 292M, 259M, 372M and 425 level A and B compliant
Re-clocked Data Rates 270 Mbps (SMPTE 259M), 1.485 Gbps (SMPTE 292), 2.97 Gbps
(SMPTE 424M)
Equalization Automatic up to 140m of Belden 1694A at 3.0 Gbps, 230m at 1.485
Gbps and 350m at 270 Mbps
Return Loss >10dB up to 2.97 Gbps
Number of Loop Outs 1
Number of Optical Outputs 2
DC Signal Level
800mV ± 10%
DC Offset 0V ± 0.5V
Overshoot < 10% of amplitude
Timing Jitter < 0.2 UI at 270 Mbps; < 1.0 UI at 1.485 Gbps;
< 2 UI at 2.97 Gbps with color bar signal
Alignment Jitter < 0.2 UI at 270 Mbps 1.485 Gbps;
< 0.3 UI at 2.97 Gbps with color bar signal
Rise/Fall Time 0.4 ns to 1.5 ns at 270 Mbps per SMPTE 259M
< 270 ps at 1.485 Gbps per SMPTE 292;
< 135 ps at 2.97 Gbps per SMPTE 424M;
Re-clocking At 270 Mbps, 1.485 Gbps, and 2.97 Gbps