Document Outline

• HP ProLiant DL320 G6 Server User Guide
• Notice
• Contents
• Component identification
  • Front panel components
  • Front panel LEDs and buttons
  • SAS and SATA device numbers
  • Rear panel components
  • Rear panel LEDs and buttons
  • PCI expansion slot definitions
  • System board components
    • System maintenance switch
      • NMI functionality
  • System board LEDs
  • System LEDs and internal health LED combinations
  • Fan locations
• Operations
  • Power up the server
  • Power down the server
  • Remove the server from the rack
  • Remove the access panel
  • Remove the air baffle
  • Remove the PCI riser board assembly
  • Install the PCI riser board assembly
• Setup
  • Optional installation services
  • Rack planning resources
  • Optimum environment
    • Space and airflow requirements
    • Temperature requirements
    • Power requirements
    • Electrical grounding requirements
  • Rack warnings
  • Identifying the server shipping carton contents
  • Installing hardware options
  • Installing the server into the rack
  • Installing the operating system
  • Powering up and configuring the server
  • Registering the server
• Hardware options installation
  • Introduction
  • Memory options
    • Memory subsystem architecture
    • Single-, dual-, and quad-rank DIMMs
    • DIMM identification
    • Memory configurations
      • RDIMM maximum memory configurations
      • UDIMM maximum memory configurations
      • Advanced ECC memory configuration
      • Lockstep memory configuration
    • General DIMM slot population guidelines
      • Advanced ECC population guidelines
        • Single-processor Advanced ECC population order
      • Lockstep Memory population guidelines
        • Single-processor Lockstep population order
    • Installing a DIMM
  • Redundant hot-plug power supply option
  • Hard drive options
    • Hard drive guidelines
    • Removing a hard drive blank
    • Removing a hard drive
    • Installing a hard drive
  • Optical drive option
  • Dedicated iLO 2 port module option
  • Expansion board option
  • PCI-X riser board option
  • Storage controller option
  • Flash-backed write cache capacitor pack option
  • Battery-backed write cache battery pack option
  • HP Trusted Platform Module option
    • Installing the Trusted Platform Module board
    • Retaining the recovery key/password
    • Enabling the Trusted Platform Module
• Cabling
  • Cabling overview
  • Non-redundant power supply cabling
  • Optional non-redundant high-efficiency power supply cabling
  • Optional redundant power supply cabling
  • Optional Common Slot Power Supply cabling
  • SATA cabling
  • Optional SAS controller cabling
  • BBWC battery pack or FBWC capacitor pack cabling to an optional controller
• Configuration and utilities
  • Configuration tools
    • SmartStart software
      • SmartStart Scripting Toolkit
      • Configuration Replication Utility
    • HP ROM-Based Setup Utility
      • Using RBSU
      • Auto-configuration process
      • Boot options
      • BIOS Serial Console
      • Configuring mirrored memory
      • Configuring lockstep memory
    • Array Configuration Utility
    • Option ROM Configuration for Arrays
    • HP ProLiant Essentials Rapid Deployment Pack
    • Re-entering the server serial number and product ID
  • Management tools
    • Automatic Server Recovery
    • ROMPaq utility
    • Integrated Lights-Out 2 technology
    • Erase Utility
    • StorageWorks library and tape tools
    • HP Systems Insight Manager
    • Management Agents
    • Redundant ROM support
      • Safety and security benefits
    • USB support
    • Internal USB functionality
    • Internal SD support
  • Diagnostic tools
    • HP Insight Diagnostics
    • HP Insight Diagnostics survey functionality
    • Integrated Management Log
    • Array Diagnostic Utility
  • HP Insight Remote Support software
  • HP Insight Server Migration software for ProLiant
  • Keeping the system current
    • Drivers
    • ProLiant Support Packs
    • Operating system version support
    • System Online ROM flash component utility
    • Change control and proactive notification
    • Care Pack
• Troubleshooting
  • Troubleshooting resources
  • Pre-diagnostic steps
    • Important safety information
      • Symbols on equipment
      • Warnings and cautions
    • Symptom information
    • Prepare the server for diagnosis
  • Loose connections
  • Service notifications
  • Troubleshooting flowcharts
    • Start diagnosis flowchart
    • General diagnosis flowchart
    • Server power-on problems flowchart
    • POST problems flowchart
    • OS boot problems flowchart
    • Server fault indications flowchart
  • POST error messages and beep codes
• Battery replacement
• Regulatory compliance notices
  • Regulatory compliance identification numbers
  • Federal Communications Commission notice
    • FCC rating label
    • Class A equipment
    • Class B equipment
  • Declaration of conformity for products marked with the FCC logo, United States only
  • Modifications
  • Cables
  • Canadian notice (Avis Canadien)
  • European Union regulatory notice
  • Disposal of waste equipment by users in private households in the European Union
  • Japanese notice
  • BSMI notice
  • Korean notice
  • Chinese notice
  • Laser compliance
  • Battery replacement notice
  • Taiwan battery recycling notice
  • Power cord statement for Japan
• Electrostatic discharge
  • Preventing electrostatic discharge
  • Grounding methods to prevent electrostatic discharge
• Specifications
  • Environmental specifications
  • Mechanical specifications
  • Power supply specifications
• Technical support
  • Before you contact HP
  • HP contact information
  • Customer Self Repair
• Acronyms and abbreviations
• Index