Seiko Instruments LTP F Series - Manual (Page 13)

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z Always close the platen and feed the paper at 16 dots or more per line when printing is in a
standby state. The elastic deformation of the platen roller rubber will be retreated.
Mechanism precautions
z Apply power in the following manner:
When turning the power ON: 1) Vdd (5 V) → 2) Vp (24 V)
At shut down: 1) Vp (24 V) → 2) Vdd (5 V)
z Cut surfaces of metallic parts may become discolored and rusted due to the operational
environment. Consider these factors regarding appearance.
z Do not apply any stress to the thermal head connector when inserting and removing the
PCB (Printed Circuit Board). After the PCB has been connected to the thermal head
connector, design the outer case so that stress does not apply to the head connector.
Stress may cause printing problems, resulting in damage to the thermal head.
z Always release the pressure of the thermal head when not using the printer for a long time
(put the platen in platen open state). The platen pressured to the thermal head may become
deformed.
z When closing the platen unit, the gear of the platen driving wheel may come in contact with
the gear of the reduction wheel, making it impossible to install the platen. In this case, open
the platen, and then close it again.
z Handle the platen unit with care because it is detachable. Flaws or dust on the platen roller
and the platen driving wheel may reduce print quality. Be careful during installation
because the plate may become deformed by stress.
z Do not pull out paper when the platen unit is closed.
z Stress to the platen frame while printing may reduce print quality.