SimpleTech ZeusIOPS - Manual (Page 70)

70 Zeus IOPS 3.5-Inch Fibre Channel Solid State Drive Product Manual Rev. 1.0
D RIVE I NSTALLATION
To install the SDD in a server or host system:
1 Power down the computer/host system.
2 Remove the access cover.
3 Position the SSD in an available drive bay or choose a suitable mounting location.
4 Connect the SSD to the backplane or tailgate card. The connector on the drive is keyed to
ensure that the signal and power connections to the drive are correctly oriented.
5 Secure the SSD within the drive bay or to the mounting surface using M3 machine screws.
Apply sufficient torque to ensure that the drive is secure.
Note: Be aware of the depth of the drive’s mounting holes. The maximum penetration
depth of the drive’s mounting holes is indicated in Figure 15 on page 60. The user may
mount the drive using the side or underside mounting holes. Four (4) M3 screws will be
required to mount the drive from the bottom; six (6) M3 screws to mount the drive using the
side holes. It is recommended that the user secure the drive with at least four screws. To
avoid damaging the drive, consider the thickness of the mounting surface when deciding
on the screw length to use.
6 Replace the access cover and power on the computer/host system.
G ROUNDING R EQUIREMENTS
No special grounding circuitry is required. The signal and chassis grounds are not connected
together in the drive. The user should provide maximum surface contact area when connecting the
drive to the chassis ground to ensure minimal electromagnetic (EM) emissions.
Electro Static Discharge or ESD can seriously damage the
electronic components of the host system and solid state
drive. It is very important to discharge any static electricity
before you begin the installation procedure. You can touch an
unpainted, grounded metallic surface to discharge any static
charges that may be present on your body or clothing. As an
alternative, you can also use an ESD protective wrist strap.
You can minimize the possibility of damage due to ESD by
avoiding physical contact with the electronic components.