Ampro Corporation COM 830 - Manual (Page 17)

Chapter 2 Specifications
COM 830 Reference Manual 11
Heatspreader
An important factor for each system integration is the thermal design. The heatspreader acts as a thermal
coupling device to the module. It is a 3mm thick aluminum plate.
The heatspreader is thermally coupled to the CPU via a thermal gap filler and on some modules it may also
be thermally coupled to other heat generating components with the use of additional thermal gap fillers.
Although the heatspreader is the thermal interface where most of the heat generated by the module is
dissipated, it is not to be considered as a heatsink. It has been designed to be used as a thermal interface
between the module and the application specific thermal solution. The application specific thermal solution
may use heatsinks with fans, and/or heat pipes, which can be attached to the heatspreader. Some thermal
solutions may also require that the heatspreader is attached directly to the systems chassis therefore using the
whole chassis as a heat dissipater.
CAUTION Attention must be given to the mounting solution used to mount the heatspreader
and module into the system chassis. Do not use a threaded heatspreader together
with threaded carrier board standoffs. The combination of the two threads may be
staggered, which could lead to stripping or cross-threading of the threads in either
the standoffs of the heatspreader or carrier board.