Kontron VMP3 - Manual (Page 127)

VMP3 System Considerations
ID 29230, Rev. 01 © 2005 Kontron Modular Computers GmbH Page 6 - 3
30504
.01.VC.050727/091441
P R E L I M I N A R Y
6. System Considerations
Successful implementation of the VMP3 CPU board in any given application is a function of a
wide variety of factors. To assist system integrators in achieving optimum solutions, additional
technical information concerning:
• Thermal design
• Power requirements
is provided by this section.
6.1 Thermal Design Considerations
The VMP3 is designed to be operated in a wide range of thermal environments. Basic thermal
management mechanisms have been incorporated, and, depending on the application require-
ments, there are configurations available which should satisfy most situations. Still it is neces-
sary for system integrators to be aware of certain concepts and capabilities of the VMP3 when
projecting overall system thermal management. The following provides more detailed informa-
tion concerning aspects that must be considered before the VMP3 is integrated in an applica-
tion system.
6.1.1 Thermodynamics Terminology
In order to facilitate understanding the factors involved in the thermal considerations being dis-
cussed here, the following definitions provided.
Table 6-1: Thermodynamics Terminology as Relating to the VMP3
TERM DEFINITION
Heat The thermal energy of a body.
The primary source of heat in VMP3 is the CPU which requires cooling.
Cooling Reduction of the temperature of a body. The transfer of heat from a body.
Cooling is a somewhat relative term when applied to systems which generate heat
due to the continuous application of external energy. In the case of the VMP3 con-
tinuous operation without “cooling” would lead to the ultimate destruction of the
CPU and other components. With cooling, however, board components are
allowed to operate within a range of higher temperatures than would otherwise be
possible. Cooling in this case means maintaining a working temperature that does
not exceed the maximum level.
Conduction The cooling of a body by means of direct contact with another body whose temper-
ature is lower.
The VMP3 uses conduction to transfer heat from the CPU to a heat sink. The heat
sink is the primary thermal interface to the VMP3 and is an integrated part of the
VMP3. Secondary cooling of the VMP3 may be achieved either by conduction or
convection.