Compaq 21264 - Manual (Page 257)

Alpha 21264/EV67 Hardware Reference Manual Thermal Management 10–7
Thermal Design Considerations
10.3 Thermal Design Considerations
Follow these guidelines for printed circuit board (PCB) component placement:
• Orient the 21264/EV67 on the PCB with the heat sink fins aligned with the airflow
direction.
• Avoid preheating ambient air. Place the 21264/EV67 on the PCB so that inlet air is
not preheated by any other PCB components.
• Do not place other high power devices in the vicinity of the 21264/EV67.
Do not restrict the airflow across the 21264/EV67 heat sink. Placement of other devices
must allow for maximum system airflow in order to maximize the performance of the
heat sink.