HP DL785 - Manual (Page 3)

Table of Contents
1 Customer self repair.......................................................................................................7
Réparation par le client (CSR)................................................................................................................7
Riparazione da parte del cliente.............................................................................................................8
Customer Self Repair..............................................................................................................................8
Reparaciones del propio cliente..............................................................................................................9
Customer Self Repair............................................................................................................................10
Reparo feito pelo cliente.......................................................................................................................10
2 Illustrated Parts Catalog...............................................................................................13
Mechanical components.......................................................................................................................13
System components..............................................................................................................................16
3 Removal and replacement procedures......................................................................23
Required tools.......................................................................................................................................23
Safety considerations............................................................................................................................23
Preventing electrostatic discharge...................................................................................................23
Server warnings and cautions.........................................................................................................24
Preparation procedures........................................................................................................................24
Power down the server....................................................................................................................25
Extending the server from the rack.................................................................................................25
Removing the server from the rack.................................................................................................26
Removing the access panel..............................................................................................................27
Media module (SID assembly)..............................................................................................................28
Front Bezel............................................................................................................................................29
Mezzanine filler....................................................................................................................................29
Mezzanine filler bezel...........................................................................................................................29
Mezzanine board..................................................................................................................................29
Processor memory cell..........................................................................................................................29
Processor memory cell bezel.................................................................................................................30
Processor memory cell airflow baffle...................................................................................................30
Processors..............................................................................................................................................30
DIMMs..................................................................................................................................................36
SAS hard drive blank............................................................................................................................37
SAS hard drives....................................................................................................................................37
DVD, CD drive or blank.......................................................................................................................38
Power supply blank..............................................................................................................................38
Power supply........................................................................................................................................38
Hot-plug fans........................................................................................................................................39
Rear accessed hot-plug fans............................................................................................................39
Internally accessed hot-plug fans....................................................................................................40
Expansion slot covers............................................................................................................................41
Expansion boards..................................................................................................................................42
SAS backplane.......................................................................................................................................44
Battery-backed write cache procedures................................................................................................44
Removing the cache module...........................................................................................................45
Removing the BBWC battery pack..................................................................................................45
Recovering data from the battery-backed write cache....................................................................47
Power supply backplane.......................................................................................................................47
SPI (core I/O) board...............................................................................................................................48
Table of Contents 3