IEI Integration IEM-LX v1.10 - Manual (Page 150)

IEM-LX-800 ETX CPU Module
Page 134
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AC’97 controller
specification v2.3..................................14
ACPI .................................... 15, 12, 13, 127
ACPI v2.0.............................................13
Address Mapping ...................................125
Advanced BIOS Features ...................44, 51
Advanced Chipset Features ......... 44, 58, 59
Advanced Power Management .................15
AMD Geode LX 800 .............................2, 19
AMD VGA driver .....................................101
AMD® CS5536.......................................... 4
anti-static precautions...............................22
anti-static pad.......................................22
anti-static wristband..............................22
handling ...............................................22
self-grounding ......................................22
ASKIR ......................................................15
ATA ......................................................15, 5
AWARD BIOS ........................................... 5
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baseboard .......................... 4, 38, 39, 40, 43
BIOS14, 15, 5, 41, 42, 43, 44, 45, 46, 47, 48,
51, 58, 59, 61, 64, 65, 71, 72, 75, 76, 77,
78, 80, 115, 116, 122, 126
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CD-ROM ..................................................53
CF Type II ................................................. 4
CFII......................................................15, 5
chipset ..................................................... 13
Chipsets.....................................................4
COM ports .................................................4
Compact Flash......................................... 15
compact flash module ................................2
CPU module ............................................ 84
CRT ............................................... 5, 60, 61
customized platform devices ......................2
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DDR ..........................................................2
dimensions ................................................8
board .....................................................8
DIO.......................................................... 15
DOS environment .................................. 122
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electrostatic discharge.............................. 22
embedded module 2, 3, 4, 28, 37, 38, 39, 40
Embedded Technology eXtended ...............2
ETX form factor..........................................2
ETX-X1 connector.......................... 4, 27, 28
ETX-X2 connector.......................... 4, 27, 29
ETX-X3 connector.......................... 4, 27, 31
ETX-X4 connector.......................... 4, 27, 33
Example program................................... 123
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FDD ................................................... 15, 54
Floppy Disk Drive..................................... 15
form factor .................................................2
FSB ......................................................... 15