Document Outline

• HP ProLiant DL580 Generation 3 Server
• Notice
• Contents
• Server component identification
  • Front panel components
  • Front panel LEDs and buttons
  • Memory board components and LEDs
  • Processor module LEDs
  • Rear panel components
  • Rear panel LEDs and buttons
  • Power supply LEDs
  • System board components
    • System maintenance switch
    • Boot device selector switch
    • QuickFind diagnostic display LEDs
  • DIMM slot locations
  • SCSI IDs
  • Hot-plug SCSI hard drive LEDs
  • Hot-plug SCSI hard drive LED combinations
  • SATA or SAS IDs
  • SATA or SAS hard drive LEDs
  • SAS and SATA hard drive LED combinations
  • Fan locations
  • Hot-plug fan LEDs
  • BBWC LEDs
• Server operations
  • Powering up the server
  • Powering down the server
  • Extending the server from the rack
  • Removing the access panel
  • Replacing hot-plug fans
  • Removing the system cage
  • Accessing the QuickFind diagnostic display
  • Battery
• Server setup
  • Optional installation services
  • Rack planning resources
  • Optimum environment
    • Space and airflow requirements
    • Temperature requirements
    • Power requirements
    • Electrical grounding requirements
  • Rack warnings and cautions
  • Identifying rack server shipping carton contents
  • Installing hardware options
  • Installing the server into the rack
  • Installing the cable management arm
  • Powering up and configuring the server
  • Installing the operating system
  • Registering the server
• Hardware options installation
  • Introduction
  • Processor options
    • Removing the Processor Module
    • Installing a processor
  • Hot-plug SCSI hard drive options
    • Removing a hard drive blank
    • Removing a hot-plug SCSI hard drive
    • Installing a hot-plug SCSI hard drive
  • SAS and SATA hard drive guidelines
    • Installing the SAS hard drive cage
    • Installing a hot-plug SAS hard drive
  • Redundant hot-plug power supply
  • Battery-Backed Write Cache
  • DVD, diskette, and CD-RW drives
• Expansion board options
  • Expansion slot overview
    • PCI-X Hot Plug Mezzanine Option
    • PCI Express mezzanine options
  • Installing the PCI-X Hot Plug Mezzanine Option
  • Installing the PCI Express mezzanine options
  • Installing non-hot-plug expansion boards
  • Installing hot plug expansion boards
  • Removing a PCI-X Hot Plug expansion board
  • RILOE II Board
• Memory options
  • Memory overview
    • General memory configuration requirements
    • Single- and dual-rank DIMMs
  • Advanced ECC memory
  • Online spare memory
  • Hot-plug mirrored memory
  • Hot-plug RAID memory
  • Memory Boards and DIMMs
    • Removing a memory board blank
    • Removing and installing a memory board while the server is running
    • Removing and installing a memory board (non-hot-plug)
  • Configuring the memory
    • POST memory test
    • ROM-based diagnostics
    • Selecting the AMP mode
• Server cabling
  • Storage device cabling guidelines
  • PCI-X Hot Plug mezzanine cabling
  • BBWC cabling
  • RILOE II cabling
  • Hot-plug SCSI drive cabling
    • SCSI simplex mode
    • SCSI duplex mode
  • Hot-plug SAS hard drive cabling
  • USB cable assembly
  • Power switch cable assembly
• Server software and configuration utilities
  • Configuration tools
    • SmartStart software
    • SmartStart Scripting Toolkit
    • HP ROM-Based Setup Utility
      • Using RBSU
      • Auto-configuration process
      • Boot options
      • BIOS Serial Console
  • HP ProLiant Essentials Rapid Deployment Pack
  • Option ROM Configuration for Arrays
  • Array Configuration Utility
  • Re-entering the server serial number and product ID
  • Management tools
    • Automatic Server Recovery
    • ROMPaq utility
    • System Online ROM flash component utility
    • Remote Insight Lights-Out Edition II
    • Integrated Lights-Out technology
    • Erase Utility
    • StorageWorks library and tape tools
    • HP Systems Insight Manager
    • Management Agents
    • Redundant ROM support
      • Safety and security benefits
    • USB support
  • Diagnostic tools
    • HP Insight Diagnostics
    • Survey Utility
    • Integrated Management Log
    • Array Diagnostic Utility
  • Remote support and analysis tools
    • HP Instant Support Enterprise Edition
  • Keeping the system current
    • Drivers
    • Resource Paqs
    • ProLiant Support Packs
    • Operating system version support
    • Change control and proactive notification
    • Natural language search assistant
    • Care Pack
• Electrostatic discharge
  • Preventing electrostatic discharge
  • Grounding methods to prevent electrostatic discharge
• Troubleshooting
  • Additional information
  • Server diagnostic steps
  • Important safety information
    • Symbols on equipment
    • Warnings and cautions
  • Preparing the server for diagnosis
  • Symptom information
  • Service notifications
  • Loose connections
  • Diagnostic steps
    • Start diagnosis flowchart
    • General diagnosis flowchart
    • Power-on problems flowchart
    • POST problems flowchart
    • OS boot problems flowchart
    • Server fault indications flowchart
  • POST error messages and beep codes
    • Introduction to POST error messages
      • 209-Hot-add Memory Configuration - Boards must be installed sequentially
      • 209-Mirror Memory Configuration - DIMMs on Both Boards do not Match
      • Processor Reduced Power Mode Enabled in RBSU
      • Processor Not Started (Processor Stalled)
      • Processor Not Started (Stepping Does Not Match)
      • Processor Not Started (Unsupported Processor Stepping)
      • Processor Not Supported (Unsupported Core Speed)
      • Unsupported PCI Card Detected Remove PCI Card from Slot
      • Unsupported Processor Configuration (Processor Required in Slot #1)
      • Warning - Mixed Feature Processors Were Detected
      • WARNING - Resetting Corrupted CMOS
      • WARNING - Resetting Corrupted NVRAM
      • WARNING - Resetting Corrupted System Environment
      • WARNING - Restoring Default Configurations as Requested
  • Other information resources
• Regulatory compliance notices
  • Regulatory compliance identification numbers
  • Federal Communications Commission notice
    • FCC rating label
    • Class A equipment
    • Class B equipment
  • Declaration of conformity for products marked with the FCC logo, United States only
  • Modifications
  • Cables
  • Mouse compliance statement
  • Canadian notice (Avis Canadien)
  • European Union regulatory notice
  • Japanese notice
  • BSMI notice
  • Korean notice A&B
  • Laser compliance
  • Battery replacement notice
  • Taiwan battery recycling notice
  • Power cord statement for Japan
• Server specifications
  • Environmental specifications
  • Server specifications
• Technical support
  • Before you contact HP
  • HP contact information
  • Customer self repair
• Acronyms and abbreviations
• Index