Cirrus Logic CS4270 - Manual (Page 43)

DS686F1 43
CS4270
11.PACKAGE DIMENSIONS
1. “D” and “E1” are reference datums and do not include mold flash or protrusions, but do include mold
mismatch and are measured at the parting line. Mold flash or protrusions shall not exceed 0.20 mm per
side.
2. Dimension “b” does not include dambar protrusion/intrusion. Allowable dambar protrusion shall be
0.13 mm total in excess of “b” dimension at maximum material condition. Dambar intrusion shall not re-
duce dimension “b” by more than 0.07 mm at least material condition.
3. These dimensions apply to the flat section of the lead between 0.10 and 0.25 mm from lead tips.
THERMAL CHARACTERISTICS
4. 
JA
is specified according to JEDEC specifications for multi-layer PCBs.
INCHES MILLIMETERS NOTE
DIM MIN NOM MAX MIN NOM MAX
A -- -- 0.47 -- -- 1.20
A1 0.00197 0.00394 0.00591 0.05 0.10 0.15
A2 0.03150 0.0394 0.04137 0.80 1.00 1.05
b 0.00748 0.00965 0.01182 0.19 0.245 0.30 2 , 3
D 0.30338 BSC 0.30732 BSC 0.31126 BSC 7.70 BSC 7.80 BSC 7.90 BSC 1
E 0.24822 0.25216 0.25610 6.30 6.40 6.50
E1 0.16942 0.17336 0.17730 4.30 4.40 4.50 1
e -- 0.026 BSC -- -- 0.65 BSC --
L 0.01970 0.02364 0.02955 0.50 0.60 0.75
µ 0° 4° 8° 0° 4° 8°
JEDEC #: MO-153
Controlling Dimension is Millimeters.
Parameters Symbol Min Typ Max Units
Allowable Junction Temperature - - 135 C
Junction to Ambient Thermal Impedance (Note 4)
(Multi-layer PCB) TSSOP
(Single-layer PCB) TSSOP

JA-M

JA-S
-
- 70
105
-
- C/W
C/W
24L TSSOP (4.4 mm BODY) PACKAGE DRAWING
E
N
1 2 3
e b 2
A1
A2 A
D
SEATING
PLANE
E1 1
L
SIDE VIEW
END VIEW
TOP VIEW
