Rockwell Automation 1762-OA8 Solid State Output Module - Manual (Page 5)

Solid-State Output Module 5
Publication 1762-IN007B-EN-P- June 2013
Mounting
Minimum Spacing
Maintain spacing from
enclosure walls, wireways,
adjacent equipment, etc.
Allow 50.8 mm (2 in.) of
space on all sides for adequate
ventilation, as shown:
ATTENTION Do not remove protective debris strip until after the module and all other
equipment near the module is mounted and wiring is complete. Once
wiring is complete and the module is free of debris, carefully remove
protective debris strip. Failure to remove strip before operating can cause
overheating.
TIP 1762 expansion I/O may be mounted horizontally only.
ATTENTION
During panel or DIN rail mounting of all devices, be sure that all debris
(metal chips, wire strands, etc.) is kept from falling into the module.
Debris that falls into the module could cause damage when power is
applied to the module.
MicroLogix
1200
1762 I/O 1762 I/O 1762 I/O
Side Side
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