3 functional description, 1 cpu, memory and chipset, Functional description – ADLINK aTCA-9300 User Manual

Page 17: Cpu, memory and chipset, 1 cpu

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3 Functional Description

3.1 CPU, Memory and Chipset

3.1.1 CPU

The Intel® Xeon® processor E3 1275V2/E3 1225V2/Core i3 implements several key
technologies:

‹

Two channels of DDR3 Unbuffered Dual In-Line Memory Modules (UDIMM) with a

maximum of two DIMMs per channel

‹

Integrated I/O with up to 16 lanes for PCI Express Generation 3.0

‹

8 /3MB of shared cache

‹

Streaming SIMD Extensions 2 (SSE2), Streaming SIMD Extensions 3 (SSE3) and

Streaming SIMD Extensions 4 (SSE4)


The Intel® Xeon® processor E3-1275V2 /E3-1225V2/ Core i3 supports several advanced
technologies:

‹

Execute Disable Bit

‹

Intel® 64 Technology

‹

Enhanced Intel® SpeedStep® Technology

‹

Intel® Virtualization Technology (Intel® VT)

‹

Intel® Hyper-Threading Technology (Intel® HT Technology)

The Intel® Xeon® processor E3 1275V2/ E3 1225V2 /Core i3 3220 has a maximum TDP of
77W/55W and has an elevated case temperature specification. The elevated case
temperatures are intended to meet the short-term thermal profile requirements of NEBS Level
3. The Intel® Xeon® processor is ideal for thermally constrained form factors in embedded
servers, communications and storage markets.

Supported Processors, Maximum Power Dissipation

The following table describes the Intel® Xeon® processor E5 family CPUs supported by the
aTCA-9300:

Name

E3 1275V2

E3 1225V2

Core i3

cache 8M

8M 3MB

Clock 3.5GHz 3.2 3.3GHz
QPI

8.0 GT/s

8.0 GT/s

N/A

TDP

77W

77W

55W

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