ADLINK ETX-PVR - Manual (Page 23)

Chapter 2 Product Overview
ETX-PVR Reference Manual 17
Thermal/Cooling Requirements
The CPU, I/O Hub, and voltage regulators are the main sources of heat on the board.The ETX-PVR is
designed to operate at the maximum speeds of the N455 (1.66GHz) or N525 (1.80GHz) CPUs and requires
a cooling solution. ADLINK offers two cooling solutions, as well as a heat spreader platform on which to
build a cooling solution (see Table 2-7 for descriptions of the cooling solution options.) Figure 2-12 provides
the height measurements from the bottoms of the ETX connectors to the tops of the cooling components.
Figure 2-12. Stack Heights of Cooling Assemblies
NOTE The overall system design must keep the ICs within their operating temperature
specifications.
Table 2-7. ADLINK Optional Cooling Solutions
Cooling Solution Description
Passive Heat Sink
(without fan) Qualified to maintain optimal performance up to +70°C.
Active Heat Sink
(with fan) Qualified to maintain optimal performance up to +85°C.
Heat Spreader Provides a simple thermal platform on which to build a cooling solution.
NOTE All heights are given in inches.
Heat Spreader
ETX-PVR
COM Board
0.52
ETX
Connector
ETX-PVR_Cooling_Ht_b
ETX-PVR with Heat Spreader
Heat
Sink
ETX-PVR
COM Board
ETX
Connector
2.23
ETX-PVR with Active Heat Sink (Fan)
Heat
Sink
ETX-PVR
COM Board
ETX
Connector
1.56
ETX-PVR with Passive Heat Sink (no Fan)