Ivoclar Vivadent Heliobond - Manual (Page 2)

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– Apply Total Etch on the enamel surfaces to be treated
and allow it to react for 15-30 s. Afterwards, carefully
rinse with water spray and dry the etched surfaces
with a stream of air (use only water- and oil-free air).
– A dry operating field must be ensured. Ideally, a
rubber dam should be placed (e.g. OptraDam ® Plus).
– The etched and dried enamel surface must not be
contaminated prior to the application of Heliobond (if
the surface comes into contact with saliva or blood,
the etching and drying procedures must be repeated).
Dosage
– Dosage depends on the indication. When used as a
bonding agent, a very thin layer of Heliobond should
be applied. If necessary, use a stream of air to
achieve an optimal thin layer.
– When used as a transparent fissure sealant,
Heliobond must be applied using a thicker layer.
Method of application
1. Bonding agent for adhesive restorations
– Etch desired enamel surfaces (see preparation of the
enamel). If necessary, cover exposed dentin surfaces
with Syntac
® Adhesive (see Syntac instructions for
use) or appropriate base material.
– Apply a thin layer of Heliobond onto the etched
enamel surface using a brush or spherical instrument.
– An optimal, thin layer can be achieved using a stream
of air.
– If used in combination with light-curing luting
composites, Heliobond does not require separate
polymerization. For direct restorations, separate
polymerization of Heliobond is required: Light-cure
for 10 s using a light intensity of 500 to 1100
mW/cm
2 (e.g. Bluephase ® ).
– Application of the composite.
– Polymerization of the composite.
– Finishing of the restoration.
2. Transparent sealant for fissures and pits
– Etch desired enamel surfaces (see preparation of the
enamel).
– Apply Heliobond into the fissures using a suitable
instrument or brush. Avoid entrapment of air and
wait for approx. 15 s to allow penetration.
– Polymerize with light for 20 s using a light intensity
of 500 to 1100 mW/cm 2 (e.g. Bluephase).
– After curing, remove inhibited layer. Check occlusion
and grind off any excess material.
3. Preparation of resin repair work
– Roughen the smooth resin surfaces.
– If necessary, apply Monobond
® Plus (see Monobond
Plus instructions for use).
– Apply a thin layer of Heliobond (use a stream of air, if
necessary).
– Polymerize with light for 10 s using a light intensity
of 500 to 1100 mW/cm 2 (e.g. Bluephase).
Polymerization
– A polymerization time of 10 s is sufficient for thin
layers using a light intensity of 500 to 1100 mW/cm 2
(e.g. Bluephase).
– Thicker layers (e.g. sealings) require 20 s curing time
using a light intensity of 500 to 1100 mW/cm 2 (e.g.
Bluephase).
– The light probe should be held less than 5 mm above
the Heliobond surface and should not touch
unpolymerized material
Note
– Do not expose Heliobond to intensive light during
application since this will significantly shorten the
working time.
– If Heliobond is used as a cover layer (e.g. sealant), a
thin layer of unpolymerized, sticky material will
remain on the surface after polymerization due to the
oxygen inhibition. It is recommended to remove this
layer with cotton rolls, pellets or by polishing.
Storage
– Close bottle immediately after use. Exposure to light
may lead to premature polymerization.
– Storage: 2–28 °C / 36–82 °F.
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