Epson S1C88650 - Manual (Page 169)

S1C88650 TECHNICAL MANUAL EPSON 161
10 PAD LAYOUT
10 PAD LAYOUT
10.1 Diagram of Pad Layout
6.7 mm
Y
X
(0, 0)
6.7 mm
120 125 130 135 140 145 150 155 160 165 170 175
Die. No.
180
185
190
195
200
205
210
215
220
225
230
235
1 5 10 15 20 25 30 35 40 45 50 55
60
65
70
75
115
110
105
100
95
90
80
85
Chip thickness: 400 µm
Pad opening:
90 µm
■ Pad 119 is used for the IC shipment test, so you should not bond it.