HP 17 - Manual (Page 83)

NOTE: The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink
assembly and the system board components each time the fan/heat sink assembly is removed.
Replacement thermal material is included with the fan/heat sink assembly and system board spare
part kits. The following illustration shows the replacement thermal material locations.
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Thermal paste is used on the processor (1) and the heat sink section (2) that services it
●
Thermal paste is used on the graphics subsystem chip (3) and the heat sink section (4) that
services it
●
Thermal pads are used on the system board capacitors (5) and the heat sink sections (6) that
service them
ENWW Component replacement procedures 75