Samsung MUXONENAND A-DIE KFM2G16Q2A - Manual (Page 4)

MuxOneNAND2G(KFM2G16Q2A-DEBx)
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FLASH MEMORY
MuxOneNAND4G(KFN4G16Q2A-DEBx)
1.0 INTRODUCTION
This specification contains information about the Samsung Electronics Company MuxOneNAND ™‚ Flash memory product family. Section 1.0
includes a general overview, revision history, and product ordering information.
Section 2.0 describes the MuxOneNAND device. Section 3.0 provides information about device operation. Electrical specifications and tim-
ing waveforms are in Sections 4.0 through 6.0. Section 7.0 provides additional application and technical notes pertaining to use of the Mux-
OneNAND. Package dimensions are found in Section 8.0
1.1 Flash Product Type Selector
Samsung offers a variety of Flash solutions including NAND Flash, MuxOneNAND ™ and NOR Flash. Samsung offers Flash products both
component and a variety of card formats including RS-MMC, MMC, CompactFlash, and SmartMedia.
To determine which Samsung Flash product solution is best for your application, refer the product selector chart.
Density Part No. V CC (core & IO) Temperature PKG
2Gb KFM2G16Q2A-DEBx 1.8V(1.7V~1.95V) Extended 63FBGA(LF)
4Gb KFN4G16Q2A-DEBx 1.8V(1.7V~1.95V) Extended 63FBGA(LF)
Application Requires
Samsung Flash Products
NAND MuxOneNAND ™ NOR
Fast Random Read •
Fast Sequential Read • •
Fast Write/Program • •
Multi Block Erase • (Max 64 Blocks) •
Erase Suspend/Resume • •
Copyback • (EDC) • (ECC)
Lock/Unlock/Lock-Tight • •
ECC External (Hardware/Software) Internal X
Scalability • •