Package option addendum – Texas Instruments TMS320F2802 User Manual
Page 141
PACKAGE OPTION ADDENDUM
www.ti.com
24-Sep-2012
Addendum-Page 4
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
TMS320F2809PZA
ACTIVE
LQFP
PZ
100
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
TMS320F2809PZQ
ACTIVE
LQFP
PZ
100
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
TMS320F2809PZS
ACTIVE
LQFP
PZ
100
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
TMS320F2809ZGMA
ACTIVE
BGA
MICROSTAR
ZGM
100
184
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
TMS320F2809ZGMS
ACTIVE
BGA
MICROSTAR
ZGM
100
184
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
TMX320F2809GGMA
OBSOLETE
BGA
MICROSTAR
GGM
100
TBD
Call TI
Call TI
TMX320F2809PZA
OBSOLETE
LQFP
PZ
100
TBD
Call TI
Call TI
TMX320F2809PZPA
OBSOLETE
HTQFP
PZP
100
TBD
Call TI
Call TI
TMX320F2809ZGMA
OBSOLETE
BGA
MICROSTAR
ZGM
100
TBD
Call TI
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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