GE Industrial Solutions Micro-BDCBB - Manual (Page 27)

J85568E-1 Secondary DC Mini-Distribution Bay
Issue 6 January 2008 Safety 4 - 5
Electrostatic
Discharge
(ESD)
– Assume all circuit packs containing electronic
(solid-state) components can be damaged by ESD.
– When handling circuit packs (storing, inserting,
removing, etc.) or when working on the backplane,
always use the appropriate grounding procedure: either
a wrist strap connected to ground or, when standing, a
heel strap with a grounded dissipative floor mat.
– A grounded person must never hand an unprotected
circuit pack to an ungrounded person. A static discharge
from the ungrounded person through the circuit pack to
the grounded person could cause an electrostatic
discharge failure. All persons and equipment at a work
location must be at the same common ground potential
to be static safe.
– Handle all circuit packs by the faceplate or latch and by
the top and bottom outermost edges. Never touch the
components, conductors, or connector pins.
– Do not rub or wipe circuit packs to clean them unless
you and the circuit pack are at the same ground
potential.
– Observe warning labels on bags and cartons. Whenever
possible, do not remove circuit packs from antistatic
bags or cartons until ready to insert into the equipment.
Otherwise, open all circuit packs at a static-safe work
position with wrist straps and dissipative table mats.
– Upon removal from the equipment, immediately put
circuit packs into antistatic packages. Always store and
transport circuit packs in antistatic packaging. Shielding
is not required unless specified.
– Keep all static-generating materials away from all
circuit packs. These materials include common plastics
such as food wrappers, clear plastic bags, styrofoam
containers, packing material, drinking cups, notebooks,
and nonconductive plastic solder suckers. The insulation
on small hand tools does not represent a static hazard.
– Keep adhesive tape (Scotch, masking, etc.) away from
static-sensitive devices.
– When soldering static-sensitive semiconductor devices,
the soldering iron must be grounded to the work table,
which must also be earth grounded.
– Whenever possible, maintain relative humidity above
the 20-percent level.
– Minimize electrostatic discharge when handling circuit
modules.