Teledyne LeCroy WaveLink Differential Probe Series (8-13 GHz) - Manual (Page 26)

WaveLink Medium-Bandwidth (8-13 GHz) Differential Probe
SI L EAD A TTACHMENT W ITH P ROPER S TRESS R ELIEF
Using a small soldering iron tip, attach the free wires of the resistors to the appropriate test points by
carefully following the directions in the following sections.
The resistors are small in order to maintain high-frequency performance. However, they are
not sturdy enough to bear the weight of the probe module. It should be supported by other
means.
A positioning tool, such as the platform/cable assembly mounting clamp, the probe tip retaining clip,
or EZ probe positioner can be used to support the probe.
NOTE: The tip clip helps secure and reinforce the SI resistive tips. Best practice is to consistently
position the tip at the correct angle to the device under test which it is connected. See "Proper SI
Lead Positioning" on page 21 for more information. The solder-in lead provides better signal fidelity
performance with high frequency signals if it is elevated in this manner. The tip clip also helps to
secure and reinforce the SI resistive tips, and can position the resistor leads when soldering the
resistors to the test points.
SI L
EAD
B
ENDING
A
ND
S
OLDERING
P
ROCEDURE
Properly bending the SI lead tips results in a more consistent response. Upon first receiving your
SI lead, the tips are not likely to be positioned for optimal performance when soldered to your trace.
The goal is to get the resistor bodies to be parallel and the tips bent to sit on the test board traces.
1. Bend the resistor bodies to position them parallel.
2. Bend the tips in toward the center. Make the bend as close to the resistor body as possible.
Bend them to about 60° from straight.
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