Teledyne LeCroy WaveLink Differential Probe Series (8-13 GHz) - Manual (Page 59)

Operator's Manual
Environmental Compliance
E ND - OF -L IFE H ANDLING
The product is marked with this symbol to indicate that it complies with the applicable
European Union requirements to Directives 2002/96/EC and 2006/66/EC on Waste
Electrical and Electronic Equipment (WEEE) and Batteries.
The product is subject to disposal and recycling regulations that vary by country and
region. Many countries prohibit the disposal of waste electronic equipment in standard
waste receptacles. For more information about proper disposal and recycling of your Teledyne
LeCroy product, please visit teledynelecroy.com/recycle.
R ESTRICTION O F H AZARDOUS S UBSTANCES (R O HS)
The product and its accessories conform to the 2011/65/EU RoHS2 Directive, as they have been
classified as Industrial Monitoring and Control Equipment (per Article 3, Paragraph 24) and are
exempt from RoHS compliance until 22 July 2017 (per Article 4, Paragraph 3).
Probe Input Impedance and Loading
Attaching any probe to a test circuit adds some loading to the circuit under test. In most applications
the high impedance of the probe, compared to the impedance of the circuit under test, imparts
insignificant load to the test circuit. However, at very high frequencies the capacitive reactance of the
probe tip module or interconnect lead may load the circuit enough to affect the measurement.
WaveLink probes are designed to minimize these effects at high frequencies.
The SI interconnect lead tip uses a construction in which the tip termination consists of a damping
resistor with very short lead length (to minimize inductance) that is soldered to the circuit. These
damping resistors connect to a special distributed resistor on the lead. The distributed resistors
compensate for the inherent transmission loss of the probe system. The result is very broad
frequency response with relatively high impedance (refer to the figures below for equivalent input
circuit information).
These circuits represent the aggregate load placed on the test circuit, but not the actual input circuit
of the probe. For critical applications, you can enter the information of your module or lead into
SPICE or some other simulator to accurately represent the probe loading.
NOTE: To avoid degrading the high frequency performance of the probe do not extend the input
leads on the solder-in interconnect lead tip.
924234-00 53