Liebert Rack Enclosure With Integrated Water-Based Cooling XDK - Manual (Page 6)

Operating Conditions
2
2.0 O
PERATING
C
ONDITIONS
2.1 Proper Application
The XDK is a water-cooled enclosure and is intended for removing heat from electronic equipment
inside the cabinet. The cooling system in the cabinet is thermally independent of the room air. Water
is used to cool equipment installed in the XDK. No additional cooling of the server room is required.
NOTE
Under certain conditions, a small amount of heat, (approximately 0.5kW), can escape into the
room.
!
CAUTION
Risk of improper operation. Can cause equipment damage. For reliable function of the XDK,
cold water must be available in the correct amount, and at the correct temperature and
pressure. Observe water quality specified in VGB-R 455 P. (see 8.0 - Water Purity
Requirements ).
Table 1 General operating data
Ambient temperature
50°F to 95°F (10°C to 35°C)
(other temperatures upon request)
Absolute humidity in the installation location 8g H
2
O/ kg air maximum
Water temperature, supply 54°F (12°C); other temperatures upon request
Water temperature, return 64°F (18°C); other temperatures upon request
Water connection from below
Condensed water connection from below
Nominal voltage 200V to 264V (50Hz and 60 Hz)
Maximum operating pressure 145 PSI (10 bar)