NXP Semiconductors PBLS4004D - Manual (Page 12)

PBLS4004D_3 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 03 — 6 January 2009 12 of 15
NXP Semiconductors
PBLS4004D
40 V PNP BISS loadswitch
10. Soldering
Fig 18. Reflow soldering footprint SOT457 (SC-74)
Fig 19. Wave soldering footprint SOT457 (SC-74)
solder lands
solder resist
occupied area
solder paste
sot457_fr
3.45
1.95
2.825 3.3
0.45
(6 Ч )
0.55
(6
Ч
)
0.7
(6 Ч )
0.8
(6 Ч )
2.4
0.95
0.95
Dimensions in mm
sot457_fw
5.3
5.05
1.45
(6 Ч )
0.45
(2 Ч )
1.5
(4
Ч
)
2.85
1.475
1.475
solder lands
solder resist
occupied area
preferred transport
direction during soldering
Dimensions in mm