Ironwood Electronics SG-BGA User Manual - Manual (Page 5)

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Backing Plate
For an IC body size of 19mm and above, the GHz socket requires a backing plate to prevent the deflection of
the target circuit board due to the high downward forces. If the backside of target PCB contains capacitors and
resistors, a custom insulation plate with cavities milled for those capacitors and resistors can be designed. The
insulation plate sandwiches between the backing plate and the target PCB. Figure 4 shows an example
insulation plate.
BGA Socket Assembly
Refer to figure 5 for graphical illustrations.
1. Install the socket base assembly on the target PCB with the base mounting hardware (provided).
Because of the asymmetrical location of the tooling holes, the socket can be assembled onto the target
PCB with only one orientation (rotation).
2. Place BGA package (solder ball side down) into the socket. NOTE: BGA orientation on target PCB is
critical. If IC frame (optional) supplied, place it over the BGA package.
3. Place the compression plate on top of the BGA package.
Figure 4: Example Insulation Plate