Diodes ZXBM5210 - Manual (Page 13)

ZXBM5210
Document number: DS36765 Rev. 1 - 2
13 of 17
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December 2013
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UC
T
ZXBM5210
Thermal Performance
(1) Package Type: SO-8
MSOP8-EP Power Dissipation De-rating Curve (Note 11)
T
A
( °C) -40 0 25 50 60 70 80 85 90 95 100 105 110 120 125 130 140 150
P
D
(mW) 1043 1043 1043 835 751 668 584 543 501 459 417 376 334 250 209 167 83 0
Note: 11. SO-8 soldered to minimum recommended landing pads (see Package Outline Dimension section) on a 1”x1” two-layer 2oz.copper FR4 PCB
(1.6mm thickness) without any via or copper flood on the bottom layer.
(2) Package Type: SO-8EP
SO-8EP Power Dissipation De-rating Curve (Note 12)
T
A
( °C) -40 0 25 50 60 70 80 85 90 95 100 105 110 120 125 130 140 150
P
D
(mW) 2980 29080 2980 2384 2146 1907 1669 1550 1430 1430 1192 1073 954 715 596 477 238 0
Note: 12. SO-8EP exposed pad soldered to minimum recommended landing pads (see Package Outline Dimension section) on a 2”x2” two-layer
2oz.copper FR4 PCB (1.6mm thickness) with four thermal vias in the exposed PAD to the copper flood on the bottom layer
0
200
400
600
800
1000
1200
-40 -20 0 20 40 60 80 100 120 140 160
P
o
w
e
r D
is
s
ipa
ti
on
(m
W)
Temperature (°C)
SO-8 Thermal Derating Curve
Rthja = 120 o C/W; Rthjc = 19.9 o C/W
0
250
500
750
1000
1250
1500
1750
2000
2250
2500
2750
3000
3250
3500
-40 -20 0 20 40 60 80 100 120 140 160
P
o
w
e
r D
is
s
ipa
tion
(m
W)
Temperature (°C)
SO-8EP Thermal Derating Curve
Rthja = 42.1 o C/W; Rthjc = 8.5 o C/W