New prod uc t zxbm5210, Functional block diagram, Absolute maximum ratings – Diodes ZXBM5210 User Manual

Page 3: Recommended operating conditions

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ZXBM5210

Document number: DS36765 Rev. 1 - 2

3 of 17

www.diodes.com

December 2013

© Diodes Incorporated

NEW PROD

UC

T

ZXBM5210


Functional Block Diagram

Absolute Maximum Ratings

(Note 5) @T

A

= +25°C, unless otherwise specified.)

Symbol Characteristic

Values

Unit

V

M

and V

DD,

Supply voltage (Note 6)

24

V

V

OUT1,

V

OUT2

V

REF

All other pins except FWD and REV pins

24

V

V

FWD

and V

REV

FWD and REV pin voltage

7

V

V

REVERSE

Reverse supply Voltage on all pins

-0.3

V

I

OUTPUT

Output current (source and sink)- Peak

1500

mA

P

D

Package power dissipation

SO8 (Note 7)

1043

mW

SO8-EP (Note 8)

2980

mW

Ts

Storage temperature range

-65 to +150

°C

T

J

Maximum junction temperature

150

°C

ESD HBM

Human Body Model ESD withstand
capability

V

DD

, V

M

, V

REF

, FWD, REV,

GND and OUT1 OUT2 pins

6

kV

Notes:

5. Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings

only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device

reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time

6. The absolute maximum supply voltage of 24V is a transient stress rating and is not meant as a functional operating condition. It is not recommended

to operate the device at the absolute maximum rated conditions for any period of time.

7. SO-8 soldered to minimum recommended landing pads (see Package Outline Dimension section) on a 1”x1” two-layer 2oz.copper FR4 PCB

(1.6mm thickness) without any via or copper flood on the bottom layer. See thermal de-rating curves in the thermal performance section.

8. SO-8EP exposed pad soldered to minimum recommended landing pads (see Package Outline Dimension section) on a 2”x2” two-layer 2oz.copper

FR4 PCB (1.6mm thickness) with four thermal vias in the exposed PAD to the copper flood on the bottom layer. See thermal de-rating curves in the
thermal performance section.

Recommended Operating Conditions

Symbol Characteristic

Conditions Min

Max

Unit

V

DD

Supply Voltage

Operating

3

18

V

T

A

Operating Temperature Range

Operating, SO8 package

-40

+85

°C

Operating, SO8-EP package

-40

+105

°C





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